WMSIC Electronic Components

BHFUSE BSMD0603-035-6V BSMD0603

ModelBSMD0603-035-6V
Package0603
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0603-035-6V
Type
BHFUSE
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0603-035-6V
Electronic Component
1
Electronic Component
1.05mm
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.025g
Electronic Component
1.85mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0231067991
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0603-035-6V 产品概述

一、产品简介

BSMD0603-035-6V(BHFUSE/佰宏)是一款封装为0603(1.85×1.05×1.00 mm)的表贴自恢复保险元件(PPTC/电阻复位保险丝),专为低压电源保护和过流防护设计。其最大工作电压为6V,具备快速动作能力和较低的初始阻值,适用于体积受限的便携与消费类电子设备中对短路与过流保护的需求。

二、主要技术参数

  • 耐压(Vmax):6V
  • 最大允许电流(Imax):40A(瞬态冲击能力)
  • 保持电流(Ihold):350mA(在规定环境温度下长期不动作的最大电流)
  • 跳闸电流(Itrip):750mA(在标准测试条件下开始进入高阻态的电流)
  • 功耗(Pd):500mW(额定功耗)
  • 初始阻值(Rmin):200 mΩ
  • 跳断后阻值(R1max):1.4 Ω
  • 动作时间:约100 ms(在Itrip条件)
  • 工作温度范围:-40 ℃ 至 +85 ℃
  • 外形尺寸:1.85 mm × 1.05 mm × 1.00 mm
  • 封装:0603 SMD

三、产品特点与优势

  • 小体积、高度集成,适合空间受限的PCB设计;
  • 初始阻值低(≈200 mΩ),对正常工作电路压降影响小;
  • 快速动作(~100 ms)能在短时间内抑制突发过流或短路;
  • 跳断后阻值可升至至1.4 Ω,有效限制剩余电流直至故障消除;
  • 能承受高达40A的瞬态冲击,适合带有启动浪涌或突发电流的场景;
  • 宽温度范围适配户内与多数工业/消费级应用。

四、典型应用场景

  • USB、Type-C 及数据/供电接口过流保护(6V及以下系统);
  • 手机、平板、可穿戴设备、便携充电器与电源管理模块;
  • IoT/智能家居终端、小型传感器供电保护;
  • Battery pack保护、线路保护及短路/误插保护场景。

五、选型与设计建议

  • 保持电流(Ihold)应大于电路最大持续工作电流,建议留一定裕量(通常20%~50%);
  • 跳闸电流(Itrip)应高于允许的短时冲击电流,以避免频繁误动作;
  • 注意环境温度对Ihold的影响:温度升高会降低保持电流,设计时应按最高工作温度下的有效Ihold取值;
  • 由于封装小,焊盘与散热设计要注意,宽短的走线有利于冲击电流承受与热扩散;
  • 若存在重复大幅度冲击或高功率耗散场合,需评估器件在长期循环下的稳定性并考虑更大封装或其它保护方案。

六、布局与可靠性注意事项

  • 建议遵循0603封装的标准贴片焊盘设计,避免应力集中与过热;
  • 回流焊安装时参考厂方温度曲线(若无则遵循通用SMD回流规范),避免超出材料耐受温度;
  • 在高湿或腐蚀环境下考虑涂覆或密封处理以提高长期可靠性;
  • 做过流与短路试验验证板级设计,确认动作时间与恢复特性满足系统要求。

七、总结

BSMD0603-035-6V 是一款面向6V及以下系统的小型自恢复保险丝,兼具低初始阻抗、快速过流响应和较好的瞬态电流承受能力,适合现代便携与消费电子中对体积与可靠性双重要求的电路保护。选用时应综合考虑工作电流裕量、环境温度及PCB散热设计,以确保稳定可靠的保护效果。若需更高电压或更高持续功率能力,可根据应用选择更大封装或其他保护元件。

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