WMSIC Electronic Components

BHFUSE BSMD1206-110-24V BSMD1206

ModelBSMD1206-110-24V
Package1206
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1206-110-24V
Type
BHFUSE
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1206-110-24V
Electronic Component
1
Electronic Component
1.9mm
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.047g
Electronic Component
3.6mm
Electronic Component
1.4mm
Electronic Component
1
Electronic Component
300ms
Electronic Component
BM0231068002
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
24V
Power(Pd)
1W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1206-110-24V 自恢复保险丝(BHFUSE 佰宏)

一、产品概述

BSMD1206-110-24V 是佰宏(BHFUSE)出品的一款 1206 封装自恢复保险丝(PTC/PolySwitch)。器件在正常工作时呈现很低的电阻以保证最小压降;当出现过流或过温导致器件功耗增大时,内部阻值迅速上升以限制电流,待故障消除并冷却后可自动恢复原有阻值,适合对重复短路或突发过流有自恢复需求的电源保护场景。

二、主要技术参数

  • 耐压(Vmax):24 V
  • 最大持续电流(Imax):40 A
  • 保持电流(Ihold):1.1 A(器件在正常温升下允许的不触发电流)
  • 跳闸电流(Itrip):2.2 A(典型触发电流)
  • 最大消耗功率(Pd):1 W
  • 初始态阻值(Rmin):40 mΩ(典型值)
  • 跳断后阻值(R1max):270 mΩ(最大)
  • 动作时间:300 ms(典型)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 尺寸:3.6 mm × 1.9 mm × 1.4 mm(1206 封装)

三、性能特点

  • 响应快速:典型动作时间约 300 ms,可在短时间内限制过流,保护下游负载和 PCB 路径。
  • 低导通阻抗:初始态仅 40 mΩ,能保证低压降和较小的功耗。
  • 自恢复能力:故障清除后自动恢复,减少人工更换成本,适合难以维护或偏远设备。
  • 宽温度范围:-40 ℃ 到 +85 ℃,能适应多数工业和消费类环境。
  • 紧凑封装:1206 标准尺寸,便于表贴自动化加工与密集布局。

四、典型应用场景

  • USB、电源模块及数据接口的过流保护;
  • 电池包、充电电路的短路保护与电流限制;
  • 工业控制、通信设备、电源分配板;
  • 摄像头、笔记本周边、小型电机驱动电路等需重复自恢复保护的场合。

五、使用与选型注意事项

  • 电压限制:不得超过标称耐压 24 V,超过此电压可能导致器件失效。
  • 电流匹配:Ihold 与 Itrip 是在规定环境和测量条件下的典型/标称值,实际电路中应考虑温升、板上热耦合和连续工作温度对保持电流的影响;若长期工作电流接近 Ihold,应选用更高等级型号以避免误动作。
  • 功率与热设计:器件 Pd=1 W 为允许的最大耗散,布局时应保证周边散热良好,避免热源叠加导致误触发。
  • 不替代一次性熔断器:对于需要快速熔断或能量释放大的短路(如直接短接电源总线)的保护,应评估是否需配合一次性熔断器或电子断路器。
  • 焊接与工艺:符合 1206 表贴的回流焊工艺规范,注意峰值回流温度与时长,避免超标引起性能退化。
  • 周期性动作影响:频繁重复触发会影响器件寿命和特性,设计时应尽量消除重复过流源。

六、封装与电路连接建议

  • 封装:1206(3.6 × 1.9 × 1.4 mm),便于自动贴装和回流焊接。
  • 连接位置:建议将自恢复保险丝串联置于电源入端或被保护元件的供电线靠近源头的位置,以便在过流时优先限制并保护后端电路。
  • PCB 布局:为降低寄生热影响,避免在器件附近放置高热元件,铺大面积铜箔利于散热;走线宽度和焊盘尺寸按照制造商推荐的焊盘图执行。

以上信息基于 BSMD1206-110-24V 的典型参数与应用建议,实际设计请选择符合电流、温度和安全需求的型号并参考厂家数据手册进行最终验证。若需 PDF 数据表或具体电路示例,可提供进一步支持。

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