WMSIC Electronic Components

BHFUSE BSMD0805-050-6V BSMD0805

ModelBSMD0805-050-6V
Package0805
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0805-050-6V
Type
BHFUSE
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0805-050-6V
Electronic Component
1
Electronic Component
1.5mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.027g
Electronic Component
2.2mm
Electronic Component
1.1mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0226580908
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0805-050-6V 自恢复保险丝(BHFUSE / 佰宏)产品概述

一、产品简介

BSMD0805-050-6V 是佰宏(BHFUSE)出品的一款 0805 封装自恢复保险丝(PTC/polymeric resettable fuse),适用于多种低压电路的过流保护与短路保护。器件尺寸小巧(0805),适合表面贴装工艺,在工作温度范围 -40℃ ~ +85℃ 内能稳定工作,当电路出现异常过流时器件升温增阻,从而限制电流并保护下游电路;故障清除后冷却复原,可恢复低阻态。

二、主要性能特点

  • 小型0805封装,适合高密度PCB设计
  • 单次与重复故障后可自恢复,无需更换熔断器
  • 对瞬态浪涌有良好承受能力,适配常见启动/浪涌场景
  • 宽工作温度范围:-40℃ ~ +85℃

三、关键电气与机械参数

  • 型号:BSMD0805-050-6V
  • 品牌:BHFUSE(佰宏)
  • 封装:0805(表面贴装)
  • 长度:2.2 mm;宽度:1.5 mm;高度:1.1 mm
  • 最大工作电压(Vmax):6 V
  • 最大额定耗散功率(Pd):500 mW
  • 保持电流(Ihold):0.5 A(500 mA)——在此电流下器件应维持低阻状态
  • 跳闸电流(Itrip):1.0 A(1 A)——达到或超过此电流时器件进入高阻保护态(动作时间约 100 ms)
  • 初始态阻值(Rmin):100 mΩ
  • 跳断后最大阻值(R1max):850 mΩ
  • 最大瞬时承受电流(Imax):40 A(短时浪涌能力)
  • 动作时间:约 100 ms(参考值,视具体电流及热环境而变化)

四、典型应用场景

  • 移动设备与便携式电子产品的电源保护
  • USB、OTG、耳机、充电器等 5V 及以下电源线的过流保护(须小于6V)
  • 工业与通信终端的小电流分支保护
  • 模块化电路、传感器电源保护与上游短路防护

五、使用建议与注意事项

  • 不要超过最大耐压 6 V;器件仅适用于低压保护场合。
  • 连续工作电流应不超过 Ihold(500 mA);为保证裕量,建议设计连续工作电流小于 Ihold 的 80%(约 400 mA)。
  • 选型时确保 Itrip 值高于系统正常瞬态峰值(如启动电流),以避免误触发;同时 Itrip 应低于可能的故障电流以实现保护。
  • Imax(40 A)为短时浪涌承受能力,不能作为连续电流参考。长期超过 Pd(500 mW)将导致过热并缩短寿命。
  • 反复跳闸可能导致阻值漂移,关键系统应考虑冗余或故障报警策略。

六、封装与焊接建议

  • 推荐遵循常规 0805 焊盘设计,保证焊盘尺寸与焊锡覆盖良好,避免冷焊或焊点应力集中。
  • 建议采用符合 J-STD-020 的回流焊工艺(Pb-free 工艺峰值温度及保温时间按PCB和焊料规范设定)。
  • 注意在回流过程中避免对器件施加过大机械应力,焊后应进行目视或X-ray 检查以确认焊点可靠性。

七、存储与可靠性

  • 存储建议:干燥、常温、避免阳光直射与潮湿环境;长期存放前建议在密封包装中并配以干燥剂。
  • 使用过程中若发生频繁跳闸,应检查系统设计与负载情况,必要时更换更高规格的自恢复保险丝或其他保护方案。

本产品适合用于低压、低功耗电路的过流保护。选型与布局时请结合具体工作电流、浪涌特性及热环境进行验证测试,以确保系统长期可靠运行。如需样品测试或更详细的封装和热阻数据,请联系供应商获取产品数据手册与应用资料。

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