WMSIC Electronic Components

BHFUSE BSMD0603-005-33V BSMD0603

ModelBSMD0603-005-33V
Package0603
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0603-005-33V
Type
BHFUSE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0603-005-33V
Electronic Component
1
Electronic Component
1.05mm
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.022g
Electronic Component
1.85mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
1s
Electronic Component
BM0226538858
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
33V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0603-005-33V 产品概述

一、产品简介

BSMD0603-005-33V 为佰宏(BHFUSE)出品的0603封装自恢复保险丝(PPTC),尺寸为 1.85mm × 1.05mm × 1.00mm,适用于对板上微小空间与过流保护要求较高的消费电子与通信设备。器件工作稳定、响应快速,在发生过流时能自动限流并在故障解除后恢复导通,便于重复使用与维护。

二、主要参数

  • 尺寸(封装):0603,长 1.85mm,宽 1.05mm,高 1.00mm
  • 额定电压 Vmax:33V
  • 跳闸电流 Itrip:150mA(典型动作电流)
  • 保持电流 Ihold:50mA(稳态不动作电流)
  • 初始阻值 Rmin:3.8Ω(典型初始态)
  • 跳断后阻值 R1max:30Ω(动作后的最大阻抗)
  • 最大允许通过电流 Imax:40A(短时冲击/耐受能力)
  • 功耗 Pd:500mW(热功耗参考)
  • 工作温度:-40℃ ~ +85℃
  • 动作时间:约 1s(在规定过流条件下触发)

三、产品特性

  • 小尺寸:0603 封装适合高密度 SMT 板布局,节省空间。
  • 自恢复:过流解除后自动恢复导通,减少更换维护成本。
  • 快速保护:典型动作时间约 1s,在短时过流能迅速限流保护下游电路。
  • 耐冲击:可承受高达 40A 的短时冲击电流(用于浪涌或短路场景的瞬时耐受)。
  • 宽工作温度范围:-40℃ 到 +85℃,适用于室温及工业级温度环境。

四、典型应用

  • USB、串口、耳机与数据接口的过流保护
  • 手机、平板与便携设备的板级电源保护
  • LED 驱动电路、显示模组与小功率电源线路保护
  • IoT 终端、传感器与通信模块的线缆或输入保护

五、选型与电路注意事项

  • Ihold 与 Itrip 区分:系统工作电流应低于 Ihold(50mA),以避免误动作;短路或异常电流若超过 Itrip(150mA)则会在约 1s 内动作。
  • 电压与功耗:器件额定最大工作电压 33V,线路工作电压不可超过此值;500mW 的功耗指标提示在持续高电流状态下会有显著温升,需考虑周围热散逸。
  • 冲击电流:Imax=40A 表示器件可承受短时浪涌或短路冲击,但不代表可长期通过此电流,应以 Itrip/Ihold 参数为保护判断依据。
  • PCB 布局:靠近保护对象布置以减少未保护段;走线宽度与热分散考虑、避免在高温区回流焊后影响性能。
  • 测试与验证:在目标系统温度和电源条件下验证动作时间与重复恢复性,确认在最坏工况下不会误触发或无法恢复。

六、封装与可靠性

BSMD0603-005-33V 为标准表面贴装器件,适配常见 0603 SMT 贴装流程。器件经过反复动作后的阻值变化(初始 Rmin=3.8Ω,动作后 R1max≤30Ω)是自恢复型的正常特性,建议在设计冗余与可靠性评估中纳入多次动作后的性能漂移验证。出货与储存应避免潮湿与高温环境,按标准 SMT 元件处理。

如需样片、详细 I-V 曲线、动作时间在不同过流幅值下的数据或封装 3D 模型,可提供进一步支持与资料。

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