Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BHFUSE BSMD1206-050-33V BSMD1206
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BHFUSE BSMD1206-050-33V
- Type
- BHFUSE
- Minimum package
- 3500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BHFUSE
- Electronic Component
- BSMD1206-050-33V
- Electronic Component
- 1
- Electronic Component
- 1.9mm
- Package
- 1206
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.043g
- Electronic Component
- 3.6mm
- Electronic Component
- 1mm
- Electronic Component
- 1
- Electronic Component
- BM0226603854
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 33V
- Power(Pd)
- 800mW
- Current(Imax)
- 40A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSMD1206-050-33V 产品概述
一、概述
BSMD1206-050-33V 是佰宏（BHFUSE）推出的一款1206封装表面贴装自恢复保险丝（PTC resettable fuse），针对中低电流保护场景设计。器件尺寸为长3.6mm × 宽1.9mm × 高1.0mm，适配常规SMD生产与紧凑型PCB布局，用以防止过流与短路导致的器件或线路损坏。
二、主要技术参数
- 封装：1206，尺寸 3.6mm × 1.9mm × 1.0mm
- 额定耐压：最大可用到 33V
- 保持电流 Ihold：500mA（器件在25℃时的稳态不触发电流）
- 跳闸电流 Itrip：1A（典型动作区间）
- 初始态阻值 Rmin：150mΩ
- 跳闸后阻值 R1max：850mΩ（动作后限制电流）
- 最大瞬态电流 Imax：40A（短时承受能力）
- 功耗 Pd：800mW
- 工作温度范围：-40℃ ~ +85℃
三、性能特点
- 体积小、易贴装，适合手持设备与紧凑电源板设计。
- 初始阻抗低（≈150mΩ），对正常工作电压降影响小，有利于降低功耗。
- 在过流时迅速增阻限流（跳闸后阻值可达850mΩ），实现电路保护且能自恢复，省去更换成本。
- 可承受短时大电流冲击（最高多达40A），对启动浪涌或短路事件具较好容忍性。
- 宽温工作范围，适合多数民用与工业环境（-40℃~+85℃）。
四、典型应用
- USB/数据线端口保护、充电接口防护
- 电池管理系统与便携式电子设备的输出保护
- 模块化电源、适配器及通信设备的过流保护
- 工控与家电中的局部电路保护（需注意环境温度对动作特性的影响）
五、工程建议与注意事项
- 设计稳态工作电流建议控制在保持电流 Ihold 的安全裕度内（通常取 ≤80% Ihold，即约≤400mA），以减少误触发。
- 若存在频繁或长时间的大电流脉冲，应验证实际升温与动作时间，必要时选用更高Ihold型号或并联方案需谨慎（并联存在均流问题）。
- 堆焊与回流工艺应参照封装耐热限制，避免超出元件厂商推荐的焊接曲线（本说明未含具体焊接温度，请参阅佰宏官方数据手册）。
- 在高温环境中器件动作电流会降低，布板时应考虑散热与器件间距，避免邻近发热元件导致误动作。
总结：BSMD1206-050-33V 以小封装、低初阻、高浪涌承受力及自恢复保护特性，适合中低电流、空间受限的电子产品过流防护场景，工程使用时需注意电流裕度与热管理以保证可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
