WMSIC Electronic Components

BHFUSE BSMD0805-002-60V BSMD0805

ModelBSMD0805-002-60V
Package0805
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0805-002-60V
Type
BHFUSE
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0805-002-60V
Electronic Component
1
Electronic Component
1.5mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.025g
Electronic Component
2.2mm
Electronic Component
0.9mm
Electronic Component
1
Electronic Component
1.5s
Electronic Component
BM0228072371
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
60V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0805-002-60V 产品概述

一、产品简介

BSMD0805-002-60V(品牌:BHFUSE/佰宏)是一款用于电路过流保护的小型贴片自恢复(一体式)保险元件,采用0805封装,体积小、响应稳定,适合对电流、短路及异常功率情况提供可重复保护的场合。该器件在过流后不会永久断路,可在故障解除后自动恢复导通,方便维护与批量生产。

二、主要电气参数

  • 耐压(Vmax):60 V
  • 最大断开电流(Imax):40 A
  • 保持电流(Ihold):20 mA
  • 跳闸电流(Itrip):60 mA
  • 动作时间(典型):1.5 s
  • 消耗功率(Pd):500 mW
  • 初始态阻值(Rmin):12 Ω
  • 跳断后最大阻值(R1max):70 Ω
  • 工作温度:-40 ℃ ~ +85 ℃

三、结构与尺寸

  • 封装:0805 SMD
  • 长度:2.2 mm,宽度:1.5 mm,高度:0.9 mm
    小封装便于高密度PCB布板,适合集成在数据线、低压电源与接口保护电路中。

四、典型应用场景

  • USB/数据接口与信号线过流保护
  • 消费电子与移动设备的外设保护
  • 通信设备、路由器、机顶盒的电源及外围保护
  • 小功率电源模块、传感器模块与电池保护电路

五、设计与选型建议

  • 选型要点:Ihold 应大于正常工作最大电流(建议留 20–50% 安全裕度),Itrip 与系统允许的短时峰值对比确认是否能在容许时间内动作。
  • 功耗与热管理:Pd=500 mW,长时间接近此值会升高元件温度,须考虑PCB散热与布局避免热聚集。
  • 响应时间:动作时间约 1.5 s,适用于对瞬态浪涌有短暂延迟容忍的场合,不适合需要毫秒级保护的高速保护需求。
  • 恢复特性:为自恢复型,跳闸后阻值上升至最高约70 Ω,故障消除并冷却后恢复初始态阻值。

六、封装与焊接注意

  • 0805贴片尺寸,推荐按厂家推荐焊盘尺寸布局,确保良好焊点与热传导。
  • 建议采用无铅回流焊工艺,注意回流峰值温度与时间不要超过器件允许值(参考厂家工艺规范)。
  • 焊接后应避免强烈机械应力与过度挤压,以免影响内部结构与动作性能。

七、可靠性与使用注意

  • 工作温度范围 -40 ~ +85 ℃,在极端高温环境下动作特性可能发生漂移,应评估长期加速失效情况。
  • 设备在高频反复动作或长时间超载下会加速老化,设计时应考虑保护元件的更换策略或并用限制措施。
  • 采购与库存时注意批次一致性,若用于关键系统建议与厂商确认样品并做可靠性测试。

如需提供封装尺寸图、典型I–T曲线、热阻与推荐焊盘数据或样片测试报告,可告知,我可继续补充。

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