WMSIC Electronic Components

BHFUSE BSMD0603-003-30V BSMD0603

ModelBSMD0603-003-30V
Package0603
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0603-003-30V
Type
BHFUSE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0603-003-30V
Electronic Component
1
Electronic Component
1.05mm
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.028g
Electronic Component
1.85mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
1s
Electronic Component
BM0259707196
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
30V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0603-003-30V 自恢复保险丝(BHFUSE)

一、概述

BSMD0603-003-30V 是佰宏(BHFUSE)推出的一款 0603 封装自恢复保险丝(PTC resettable fuse),适用于小型表面贴装电路的过流保护。器件体积小(1.85 mm × 1.05 mm × 1.0 mm),在过流或短路时能快速升阻限流,消除故障后自动恢复到低阻状态,便于重复使用,适合便携设备与低压电源保护场景。

二、主要特性

  • 工作电压上限:30 V (Vmax)
  • 初始态阻值(Rmin):6 Ω(典型或最小初始阻值)
  • 跳断后阻值(R1max):≤ 50 Ω(动作后限流阻值)
  • 保持电流(Ihold):30 mA(正常工作不触发的最大电流)
  • 跳闸电流(Itrip):90 mA(在此电流附近开始显著升阻)
  • 动作时间:约 1 s(在达到触发电流时的典型动作时间)
  • 最大瞬时冲击电流:可承受短时高达 20 A(短脉冲能力,非持续值)
  • 最大功耗(Pd):500 mW(在额定条件下的功耗能力)
  • 工作温度范围:-40 ℃ ~ +85 ℃

三、封装与尺寸

  • 封装型号:0603(SMD)
  • 长度:1.85 mm
  • 宽度:1.05 mm
  • 高度:1.00 mm 小体积利于高密度贴片设计,推荐按制造商推荐的 PCB 焊盘和丝网印刷工艺布局,便于回流焊装配。

四、典型应用

  • USB、UART、I/O 接口的过流保护
  • 便携设备与物联网终端的小电流电源保护
  • 电池管理系统(低压侧保护)与充电电路的局部过流防护
  • 保护敏感模拟/数字电路免受短路或异常脉冲电流损坏

五、选型与使用建议

  • 设计工作电流应低于 Ihold(30 mA),以避免在正常条件下触发保护;若工作电流波动较大,应留有足够余量。
  • 如果存在短时脉冲电流(如瞬间浪涌),确认其幅值与持续时间在器件短时承受能力(例如标注的 20 A 冲击能力)范围内。
  • 对于需要在更高电压或更高稳定导通阻值的应用,选择相应额定电压与处置值更合适的型号。
  • 电路布局注意热管理:PTC 升温导致阻值上升,周围铜箔面积与散热环境会影响动作特性,建议在评估时以实际 PCB 板级条件进行验证。

六、注意事项

  • 动作后器件阻值升高(最高约 50 Ω),这一阶段仍有限流能力但会产生热量,请避免长时间处于跳闸状态。
  • 器件规格中的“最大电流 20 A”通常指短时脉冲承受能力,不能作为持续电流使用的依据。
  • 回流焊工艺应遵循供应商的焊接曲线建议,过高的温度或过长的加热时间可能影响可靠性。
  • 在极端环境或长期高温应用下,应进行寿命与可靠性评估。

七、可靠性与包装

该型号适用于工业级温度范围(-40 ℃ ~ +85 ℃),适合大多数民用与工业应用场景。常见为卷带(Tape & Reel)贴片包装,便于 SMT 自动化装配。批量采购和高可靠性需求时,建议向厂家索取完整的可靠性试验报告与焊接工艺说明,以便通过系统级验证。

总结:BSMD0603-003-30V 提供了小型化、可重复恢复的过流保护方案,适合对体积敏感、工作电流较小但需要可靠保护的电子产品。选用时应以 Ihold、Itrip 与电路热环境为准,必要时在 PCB 实际条件下做验证测试。

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