WMSIC Electronic Components

BHFUSE BSMD1210L-300 BSMD1210L

ModelBSMD1210L-300
Package1210
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1210L-300
Type
BHFUSE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1210L-300
Electronic Component
1
Package
1210
Electronic Component
Resettable Fuse
Electronic Component
0.049g
Electronic Component
1
Electronic Component
5s
Electronic Component
BM0231068001
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
1.2W
Current(Imax)
50A
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1210L-300 自恢复保险丝 产品概述

一、产品简介

BSMD1210L-300 是由 BHFUSE(佰宏)推出的一款 1210 封装自恢复保险丝(聚合物正温度系数自恢复保险器)。器件针对低压直流系统的过流保护设计,具有低阻抗、快速响应以及故障后自动恢复的特点,适用于需要短路/过流保护且空间受限的移动设备、通信端口和电源分配线路。

二、关键电气参数

  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 最大工作耗散功率 (Pd):1.2 W
  • 初始态阻值 (Rmin):3 mΩ(典型初始低阻抗)
  • 跳断后阻值 (R1max):26 mΩ(触发后稳定阻值上限)
  • 耐压 (Vmax):6 V(最大工作电压)
  • 跳闸电流 (Itrip):6 A(在规定条件下器件进入高阻态的参考电流)
  • 保持电流 (Ihold):3 A(器件在正常工作时允许的最大连续电流而不触发)
  • 最大电流 (Imax):50 A(可承受的瞬态冲击或短时过流能力,非持续条件)
  • 动作时间:5 s(在对应过流条件下达到保护动作所需的参考时间)

三、工作原理与热特性

该类自恢复保险丝基于温度敏感的聚合物复合材料:当通过的电流超过保持电流并接近或超过跳闸电流时,器件内部发热导致材料电阻显著上升,从而限制电流并保护后端电路。故障消除并冷却后,材料恢复低阻状态,电路自动恢复供电。Pd=1.2W 表明在稳定状态下器件能够耗散的最大功率,选型时需考虑环境温度、寄生热源及PCB散热条件对动作点的影响。

四、典型应用场景

  • USB/充电口及外设接口过流保护
  • 电源分配与加载端保护(低压直流,6V 以下系统)
  • 电池管理系统的局部保护(非主熔断)
  • 工业控制、安防与通信设备的端口保护
  • 电动工具或便携设备的短时冲击电流抑制

五、选型与使用建议

  • 电压限制:Vmax=6V,适用于 6V 以下工作电压的系统;若工作电压超过 6V,应选择额定电压更高型号。
  • 电流匹配:确保系统正常工作电流低于 Ihold(3A),而可能出现的短时过流不超过 Imax(50A),持续过流应低于 Itrip 触发阈和动作时间考虑范围。
  • 温度与散热:高环境温度会降低器件的 Ihold/ Itrip;设计时应留有裕量(常建议按温升和周围器件的热耦合进行降额)。
  • 多通道并联:并联多只自恢复保险丝不一定平均分流,需谨慎评估并行布局和热耦合。
  • 浪涌与冲击:若系统存在频繁且强烈的浪涌或长时间短路,应使用额外的过流保护器件(熔断器或电子限流)配合。

六、封装与焊接注意

BSMD1210L-300 为 1210 SMD 封装(典型尺寸约 3.2 × 2.5 mm),适合表面贴装工艺。焊接安装时建议参考厂商给出的回流焊温度曲线与PCB焊盘设计,避免长时间高温暴露以免改变材料特性。推荐在焊接后进行外观与电阻测试确认焊点质量。

七、可靠性与测试建议

  • 在最终应用环境中进行温升、老化与循环过流测试以验证动作稳定性与恢复性。
  • 对于关键应用,建议进行实际系统级的短路持续时间与自恢复次数评估。
  • 关注长期储存和使用环境的湿度与化学污染,避免影响材料性能。

总结:BSMD1210L-300 在小封装下提供了较低的初始阻抗和可靠的自恢复过流保护,适合 6V 以下、连续电流在 3A 左右的应用场合。选型时应结合环境温度、散热条件与系统可能的浪涌/短路特性进行充分评估。若需更详细的热-电特性曲线或回流焊工艺参数,建议索取厂商的完整数据手册。

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