WMSIC Electronic Components

BHFUSE BSMD0805-100-6V BSMD0805

ModelBSMD0805-100-6V
Package0805
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0805-100-6V
Type
BHFUSE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0805-100-6V
Electronic Component
1
Electronic Component
1.5mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.025g
Electronic Component
2.2mm
Electronic Component
1.2mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0225978016
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
600mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0805-100-6V 自恢复保险丝 产品概述

一、特性概述

BSMD0805-100-6V(BHFUSE 佰宏)是一款0805封装的自恢复热敏保险元件,适用于低压电源保护与短路/过流防护。器件体积小、自动复位、响应快,适合对空间和成本敏感的便携设备与消费电子应用。

二、主要参数

  • 型号:BSMD0805-100-6V(BHFUSE)
  • 封装:0805(尺寸:宽1.5mm × 长2.2mm × 高1.2mm)
  • 初始态阻值 Rmin:40 mΩ
  • 跳断后阻值 R1max:270 mΩ
  • 额定耐压 Vmax:6 V
  • 保持电流 Ihold:1 A
  • 跳闸电流 Itrip:2 A
  • 最大电流 Imax(瞬态):40 A
  • 动作时间:100 ms(典型)
  • 功耗 Pd(最大稳态耗散):600 mW
  • 工作温度:-40 ℃ ~ +85 ℃

三、工作原理与性能要点

该器件基于聚合物正温度系数材料(PPTC)原理:当通过电流在正常工作范围(≤ Ihold)时,元件阻值保持较低(Rmin),功耗小;当电流超过 Itrip 时,器件升温、阻值迅速上升至 R1max,从而限制电流,起到保护作用;故障解除并降温后可自动复位。Vmax = 6 V,适用于低压电路,Pd = 600 mW 表示器件在指定环境温度下的最大稳态耗散能力。

四、选型与应用建议

  • 常规工作电流应低于 Ihold(1 A),以避免长期热应力导致阻值漂移或频繁跳闸。
  • 瞬态浪涌电流可容许的短时间峰值靠近 Imax(40 A),但不应用于长时间通过。
  • 若电路存在较大持续电流或更高工作电压,应选择更高电流或更高电压等级的型号;本件仅适用于≤6 V 系统。
  • 注意环境温度影响:高温会降低 Itrip 与 Ihold 的裕量,设计时需进行热裕度退让。

五、布局与装配注意

  • 建议将保险丝靠近电源输入端或保护点贴装,以缩短关键回路热耦合路径。
  • 采用标准SMT工艺回流焊贴装,遵循厂商回流曲线并避免超温或过长加热时间。
  • 焊盘设计应保证良好热量散布并避免在元件下方形成热积聚区。

六、可靠性与测试建议

  • 在目标环境温度下进行 I-T 曲线和反复跳闸测试,确认在预期负载与浪涌条件下的动作行为。
  • 对于关键应用,建议做多次循环(热循环、过流循环)验证复位稳定性与阻值漂移。

七、典型应用与注意事项

适用于移动设备电源输入、USB/数据线短路保护、小型电机驱动前级保护、摄像头、蓝牙模块等低压电子产品。使用时注意不要超过6 V 额定电压,合理选择 Ihold/Itrip 与电路工作点,避免靠近大热源或通风受限区域导致误动作。

若需更详细的动态特性曲线(I-T、R-T)或回流焊温度规范,请向供应商索取完整数据手册。

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