WMSIC Electronic Components

BHFUSE BSMD0603-075-6V BSMD0603

ModelBSMD0603-075-6V
Package0603
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0603-075-6V
Type
BHFUSE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0603-075-6V
Electronic Component
1
Electronic Component
1.05mm
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.026g
Electronic Component
1.85mm
Electronic Component
1.15mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0226603272
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0603-075-6V 自恢复保险丝(BHFUSE/佰宏)产品概述

一、产品简介

BSMD0603-075-6V 为佰宏(BHFUSE)出品的0603封装自恢复式PTC保险元件(Polyfuse),体积小、响应快,适用于微型化电子设备的过流保护。外形尺寸为长1.85mm × 宽1.05mm × 高1.15mm,专为狭小空间和表贴工艺设计。

二、主要参数

  • 封装:0603(SMD)
  • 阻值(初始):Rmin = 60 mΩ
  • 跳断后最大阻值:R1max = 450 mΩ
  • 额定耐压:Vmax = 6 V
  • 跳闸电流:Itrip = 1.5 A(典型)
  • 保持电流:Ihold = 750 mA
  • 最大通过电流(瞬时/冲击):Imax = 40 A
  • 动作时间:100 ms(至跳闸)
  • 最大耗散功率:Pd = 500 mW
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 品牌:BHFUSE(佰宏)

三、性能与工作原理

该器件为正温度系数(PTC)材料制成的自恢复保险丝,正常工作时呈低阻抗(约60 mΩ),允许电路正常供电。当电流超过保持电流并接近或超过跳闸电流(1.5 A)时,内部温度上升导致材料电阻迅速增加至高阻态(跳断后≤450 mΩ),限制电流,保护下游电路。故障解除并冷却后,元件会自动恢复到低阻态,适合重复触发场合。

四、典型应用场景

  • USB、充电口与数据接口过流保护
  • 手机、平板、小型便携设备的次级电源保护
  • 物联网终端、可穿戴设备与小电流传感器模块
  • 电池管理与充电电路的短路/过流防护
  • 小型电源模块、芯片组周边保护

五、选型与使用建议

  • 正常工作电流应低于Ihold(750 mA),并留有适当裕量;若常态电流接近Ihold,应选用更高规格型号。
  • 对于可能出现短时冲击(如插拔或启动浪涌)的应用,Imax=40 A 表明短时承受能力,但不能作为长期工作电流。
  • 考虑环境温度对Ihold/Itrip的影响:高温会降低保持电流值,应按最高工作温度下的有效参数进行保守选型。
  • 电路工作电压不应超过Vmax(6 V)。

六、封装与焊接建议

  • 采用标准0603 PCB焊盘布局并遵循制造商推荐的焊盘尺寸和间距,确保可靠焊接和散热。
  • 建议使用标准回流焊工艺;避免长时间过高温度以防材料性能退化。
  • 焊接后建议进行清洗以除去残留助焊剂,避免长期影响元件性能。

七、可靠性与检测

  • 出厂前通常进行温升、冲击电流、寿命及耐压测试,用户在关键应用中可做样品验证(温度循环、长期老化、重复跳闸测试)。
  • 设计时应配合熔断时间、功耗限制和PCB散热评估,保证在异常条件下能可靠触发并在故障解除后恢复。

总结:BSMD0603-075-6V 以其超小封装和明确的电气特性,适合狭小空间内对小电流到中等电流的过流保护需求。合理的选型和PCB热管理能确保其长期稳定工作,实现对电路的高效保护。

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