WMSIC Electronic Components

BHFUSE BSMD0603-035-16V BSMD0603

ModelBSMD0603-035-16V
Package0603
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0603-035-16V
Type
BHFUSE
Minimum package
5000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0603-035-16V
Electronic Component
1
Electronic Component
1.05mm
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.025g
Electronic Component
1.85mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0228072389
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
16V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0603-035-16V 自恢复保险丝(BHFUSE)

一、产品概述

BSMD0603-035-16V 是佰宏(BHFUSE)出品的微型自恢复保险丝,采用常见 0603 封装,适用于对体积和重量有严格限制的便携与消费电子设备。器件工作原理为聚合物正温度系数(Polymeric PTC):在过流或短路时温升导致阻值急剧上升以限制电流,故障消除后冷却恢复初始低阻状态,实现可重复保护。

二、主要参数

  • 尺寸:长度 1.85 mm × 宽度 1.05 mm × 高度 1.00 mm(0603 封装)
  • 初始态阻值 Rmin:0.2 Ω(200 mΩ)
  • 跳断后阻值 R1max:1.4 Ω
  • 保持电流 Ihold:350 mA(维持正常工作不动作的最大电流)
  • 跳闸电流 Itrip:750 mA(在标准试验条件下动作电流)
  • 最大短时通过电流 Imax:40 A(短时脉冲能力)
  • 耐压 Vmax:16 V
  • 功率耗散 Pd:500 mW
  • 动作时间:100 ms(在标准测试条件下)
  • 工作温度范围:-40 ℃ ~ +85 ℃

三、关键特性

  • 极小封装(0603),便于高密度 PCB 布局与自动贴片回流工艺兼容。
  • 明确的保持电流与动作电流界限,可在电源与接口保护中提供可靠保护边界。
  • 短时高电流通过能力(最高可达 40A),能承受来自快速浪涌或短路的冲击而不损坏本体。
  • 自恢复特性适合多次暂态故障场景,减少维护与更换成本。
  • 宽温工作范围适用于工业与消费类环境。

四、典型应用

  • USB、HDMI、平板与智能手机等外设与接口过流保护。
  • 电池管理系统、便携式电源与充电器的输入/输出保护。
  • 主板电源总线、摄像头模块、物联网终端与可穿戴设备。
  • 需多次自动恢复保护且空间受限的电路设计场合。

五、封装与焊接建议

  • 采用标准 0603 SMT 工艺贴装,推荐与常规无铅回流温度曲线兼容。
  • 焊盘设计应保证良好散热与机械支撑,避免在元件附近布置大功率发热体以减少误动作。
  • 焊接后避免在器件上直接施加机械压力或弯曲 PCB,以防器件失效。
  • 储存与安装应避开长时间潮湿环境,按厂商建议进行防潮处理。

六、选型与使用注意事项

  • 工作电流选择:保证典型工作电流低于 Ihold(350 mA),以避免长期在临界点附近导致频繁动作或热老化。
  • 电压符合性:系统工作电压应低于器件耐压 16 V。
  • 冷却与布局:若电路中存在频繁浪涌,应在 PCB 布局和散热上进行优化,避免器件长时间处于高温状态。
  • 不适合作为一次性短路熔断器:自恢复保险丝在能限制故障时会复位,不适用于需要一次性切断并不可恢复的安全场景。
  • 在特殊应用(例如车规级或高温高湿环境)中,请依据具体应用进行寿命与老化测试,或咨询厂商获取更详尽的可靠性数据与曲线图。

如需更详细的电流-时间特性曲线、温升数据或 PCB 焊盘推荐图,请提供具体应用场景与典型工作条件,以便给出更精确的设计指导。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.