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BHFUSE BSMD0603C-1200T BSMD0603C
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BHFUSE BSMD0603C-1200T
- Type
- BHFUSE
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BHFUSE
- Electronic Component
- BSMD0603C-1200T
- Electronic Component
- 1
- Electronic Component
- 0.8mm
- Package
- 0603
- Type
- SMD Fuse
- Electronic Component
- Non-Resettable Fuse
- Electronic Component
- 0.029g
- Electronic Component
- 1.6mm
- I2t
- 0.126
- Electronic Component
- 1
- Electronic Component
- 50A
- Electronic Component
- BM0264819713
- Operating Temperature
- 55℃~+150℃
- Voltage
- 63V；32V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSMD0603C-1200T 产品概述
一、主要参数
- 类型：贴片式时间滞后（慢断）保险丝
- 型号：BSMD0603C-1200T（品牌：BHFUSE / 佰宏）
- 额定电流：2 A
- 额定电压：32 V / 63 V（可按应用选择相应额定电压）
- 工作温度：-55 ℃ ～ +150 ℃
- 熔断 I2t（典型）：0.126 A²s
- 分断能力：50 A
- 外形尺寸（封装 0603）：长度 1.6 mm × 宽度 0.8 mm
二、产品特性
- 时间滞后特性：对短时浪涌电流（如启动冲击、电容充电浪涌）具有良好耐受性，仅在持续过流或严重短路时动作，适合有启动电流或冲击电流的电路保护。
- 无焊料内部结构：采用无焊料设计，提高了元件在温度循环与机械冲击下的稳定性与可靠性，热循环性能优于常规超小型保险丝。
- 高分断能力：50 A 的分断能力可在典型便携与工业电子短路条件下可靠切断故障电流，减少后级器件损伤风险。
- 宽温度适应性：-55 ℃ 至 +150 ℃ 的工作温度范围，适合多类环境与温升条件下长期使用。
三、结构与封装说明
- 封装：0603 超小型 SMD，适配常规贴片生产工艺，占板面积小，有利于高密度设计。
- 尺寸：1.6 × 0.8 mm，适用于紧凑型移动设备、消费类电子和便携仪器。
- 焊接与装配：建议按厂方数据手册提供的焊盘尺寸和回流工艺参数进行装配，确保焊点可靠与热应力最小化；无焊料内部结构对焊接流程有更高的耐受性，但仍需遵循推荐工艺。
四、典型应用场景
- 手机、平板、可穿戴设备等便携消费电子的电源与子系统保护；
- 电池管理系统（BMS）中对输出或分支回路的过流保护；
- 通信设备、物联网终端、摄像模组等对空间与重量敏感的电子产品；
- 工业控制器与模块化电源中需要时间滞后保护以抑制启动浪涌的场合。
五、可靠性与使用建议
- 选型时请以最大工作电流、持续工作环境温度与预期冲击电流特性为依据，留有足够裕量以避免长期在额定值附近连续工作产生过大温升。
- 对于高频率的过流/冲击事件，建议评估熔断寿命并与系统保护策略（如熔断 + 限流）配合使用。
- 储存与装配应避光、防潮，并遵循贴片元件的常规 ESD、防潮措施；回流焊时遵守温度曲线以避免过热。
- 关键应用建议进行实际电路的过流-时间测试，并参考厂方完整的时间—电流特性曲线（I-t 曲线）和环境温度校正数据。
六、订购与支持
- 品牌：BHFUSE（佰宏），提供批量供货、样品和技术支持。
- 如需器件数据表、封装尺寸图、回流曲线或更详细的时间—电流特性（I-t）曲线图，请联系供应商或厂方技术支持以获取最新版资料与测试报告。
BSMD0603C-1200T 以其超小体积、时间滞后保护特性与耐热抗冲击的无焊料结构，适合对空间、可靠性和对启动浪涌耐受性有较高要求的现代电子产品保护设计。
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