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BHFUSE BSMD0805-075-6V BSMD0805
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BHFUSE BSMD0805-075-6V
- Type
- BHFUSE
- Minimum package
- 4000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BHFUSE
- Electronic Component
- BSMD0805-075-6V
- Electronic Component
- 1
- Electronic Component
- 1.5mm
- Package
- 0805
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.03g
- Electronic Component
- 2.2mm
- Electronic Component
- 1.1mm
- Electronic Component
- 1
- Electronic Component
- 200ms
- Electronic Component
- BM0228072385
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 6V
- Power(Pd)
- 500mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSMD0805-075-6V 产品概述
一、产品简介
BSMD0805-075-6V 为 BHFUSE（佰宏）推出的 0805 封装自恢复保险丝（PTC Resettable Fuse），专为低压、短路保护及过流防护设计。器件尺寸为 2.2 × 1.5 × 1.1 mm，适配表面贴装工艺，能在重复过流事件后自动恢复，降低维护成本并提高系统可靠性。
二、主要参数
- 耐压 (Vmax)：6V
- 最大电流 (Imax)：40A（瞬态承受能力）
- 保持电流 (Ihold)：750mA
- 跳闸电流 (Itrip)：1.5A
- 消耗功率 (Pd)：500mW（稳态功耗参考）
- 初始态阻值 (Rmin)：70 mΩ
- 跳断后阻值 (R1max)：385 mΩ
- 动作时间：200 ms（典型）
- 工作温度：-40 ℃ ～ +85 ℃
- 封装：0805（尺寸见上）
- 品牌：BHFUSE（佰宏）
三、产品特性与优势
- 小尺寸：0805 紧凑封装，适合空间受限的便携与消费电子设备。
- 快速响应：典型动作时间约 200 ms，可迅速限制过流，保护下游器件。
- 自恢复：过流解除后自动恢复导通，无需更换，节省维护成本。
- 低初始阻抗：70 mΩ 起，能在不显著影响电压的前提下提供保护。
- 宽温区：工作温度覆盖 -40 ℃ 至 +85 ℃，适应大多数工业与民用环境。
四、典型应用场景
- 移动设备充电与电源管理模块（低压 5V/6V 系统）
- USB、Type-C 外围保护
- 便携式音频、摄像设备的电源输入保护
- 工业传感器、通信模块的短路与过流防护
五、选型与使用建议
- 若系统额定工作电流接近或超过 Ihold，应选更大规格或在电路中并联设计以减小发热。
- 对于瞬态大电流（如电机起动、浪涌）需确认 Imax 与实际冲击能量匹配，必要时加用浪涌抑制器件。
- 在高温环境下请留有热裕量，器件温升会影响动作点与恢复性能。
- 推荐在靠近电源输入处布局，减少保护线段的寄生电阻与感抗。
六、安装与可靠性
- 采用标准回流焊工艺，注意避免超出元件耐受的热循环及焊接时间。
- 建议在 PCB 走线处提供足够铜面积以利散热，并避免在高热源附近直贴放置。
- 经多次动作后器件性能会趋于稳定，但强烈反复过载可能影响长期可靠性，应进行设计冗余。
七、注意事项与包装
- 本产品最大耐压仅 6V，请勿用于高压场合。
- 在确定器件位置前，请结合实际电路仿真或样机测试确认动作点。
- 包装与订购请参照 BHFUSE 官方规格书与料号信息，批量采购可咨询供应商以获取完整质量与交期支持。
如需器件的详细电气特性曲线、回流焊温度剖面或样片测试报告，可提供进一步支持与资料。
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