WMSIC Electronic Components

BHFUSE BSMD0805-001-60V BSMD0805

ModelBSMD0805-001-60V
Package0805
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0805-001-60V
Type
BHFUSE
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0805-001-60V
Electronic Component
1
Electronic Component
1.5mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.024g
Electronic Component
2.2mm
Electronic Component
0.9mm
Electronic Component
1
Electronic Component
1.5s
Electronic Component
BM0229474014
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
60V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0805-001-60V 产品概述

一、产品简介

BSMD0805-001-60V 是佰宏(BHFUSE)推出的一款面向低电流线路保护的贴片自恢复保险(PPTC)类元件,封装符合0805标准(尺寸:2.2mm × 1.5mm × 0.9mm)。器件针对信号线、弱电供电及接口保护优化,能够在过流时快速进入高阻态并在故障清除后自动恢复,便于重复使用与维修。

二、主要电气参数与含义

  • 耐压(Vmax):60V —— 适用于最高工作电压不超过60V的系统。
  • 最大电流(Imax):40A —— 器件的极限承受值,通常指短时冲击或极端条件下的容许峰值,非连续工作电流。
  • 保持电流(Ihold):10mA —— 器件在正常工作时应保持不动作的最大电流,电路稳态工作电流应低于此值。
  • 跳闸电流(Itrip):50mA —— 在该电流水平及以上器件在规定条件下将触发进入高阻态。
  • 消耗功率(Pd):500mW —— 器件在稳态时允许的最大功耗,设计时需考虑环境温度与PCB散热。
  • 初始态阻值(Rmin):15Ω —— 未触发前的典型接触阻值。
  • 跳断后阻值(R1max):100Ω —— 触发后进入高阻态的最大阻值范围。
  • 动作时间:1.5s —— 在特定过流条件下完成从低阻到高阻的典型响应时间。
  • 工作温度:-40℃ ~ +85℃ —— 适合工业级温度范围。

以上参数为设计选型参考,具体测试条件请参阅厂方详细数据手册。

三、封装与机械特性

封装为0805(2.2 × 1.5 × 0.9 mm),便于与常见SMD工艺兼容。建议按0805标准的焊盘尺寸和回流曲线进行贴片与焊接,焊接过程应避免超过器件最高允许温度并遵循佰宏给出的回流建议。

四、典型应用场景

  • USB/串口等低电流接口短路保护;
  • 各类传感器、I2C/SPI总线及信号线防护;
  • 低压控制电路和小功率嵌入式模块的过流保护;
  • 电池管理与便携设备的弱电回路保护(前提电压≤60V)。

五、设计与使用建议

  • 确保电路正常工作电流显著低于Ihold(10mA),否则可能发生误动作;
  • 如电路存在短时大电流冲击(如浪涌),应核实是否会超过Imax(40A)的短时承载能力,并结合系统熔断策略;
  • 在布局时将器件靠近可能的短路源(如电源输入)以缩短故障回路;
  • 考虑环境温度的热漂移,对Itrip和Ihold进行留余设计;同时避免器件长期在Pd附近运行以防发热和性能退化;
  • 推荐在样机阶段进行实际环境下的温升、动作时间与重复触发测试。

六、注意事项与售后

  • 该型号适合低电流保护,若系统运行电流较大或需承受连续大电流,应选用额定电流更高或专用保护器件;
  • 器件特性会随温度与封装散热条件变化,请在目标工况下完成验证;
  • 购买与批量应用前建议向佰宏索取完整数据手册与可靠性测试报告,以获取详细的测试条件、回流曲线和应用示例。

总结:BSMD0805-001-60V 以其微小尺寸、自动复位特性和对低电流线路的精准保护,适合现代便携与智能设备的信号与弱电保护需求。欲获取样品或技术资料,请联系佰宏(BHFUSE)。

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