WMSIC Electronic Components

BHFUSE BSMD1206-050-24V BSMD1206

ModelBSMD1206-050-24V
Package1206
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1206-050-24V
Type
1206
Minimum package
3500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1206-050-24V
Electronic Component
1
Electronic Component
1.9mm
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.037g
Electronic Component
3.6mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0228072381
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
24V
Power(Pd)
600mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1206-050-24V 产品概述

一、简介

BSMD1206-050-24V 是佰宏(BHFUSE)出品的一款 1206 封装自恢复保险丝(PTC),专为要求可重复保护、空间受限的低压电子系统设计。该器件在过流后自动跳闸限流,故障解除或冷却后恢复低阻态,适合 PCB 贴片安装和标准回流焊工艺。

二、主要技术参数

  • 耐压(Vmax):24 V
  • 最大电流(Imax):40 A(短时脉冲容许)
  • 保持电流(Ihold):0.50 A(不动作电流)
  • 跳闸电流(Itrip):1.0 A(动作电流)
  • 消耗功率(Pd):600 mW(稳态功耗上限)
  • 初始态阻值(Rmin):150 mΩ
  • 跳断后阻值(R1max):850 mΩ
  • 动作时间:约 100 ms(典型)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 尺寸:3.6 mm × 1.9 mm × 1.0 mm(1206)

三、特性与工作原理

  • 自恢复:过流时内部正温度系数材料受热阻值快速上升,限制电流;故障清除并冷却后阻值恢复低态,自动复位。
  • 快速反应:典型动作时间约 100 ms,可过滤短时冲击但能对持续过流实现保护。
  • 低压降与低功耗:在保持电流下压降小(V = I×R,0.5A×0.15Ω ≈ 0.075V;功耗 ≈ 37.5 mW),远低于 600 mW 的允许功耗。
  • 受环境影响:周围温度、散热条件会影响动作特性,建议在实际工况下验证。

四、典型应用

  • 12V/24V 消费电子电源保护(充电器、适配器)
  • USB/外设接口、电池管理、便携设备过流保护
  • LED 驱动、通信设备、工业控制模块的短路与过流保护
    注意:由于 Vmax 为 24V,适合低压系统,非高压或需要完全断开隔离的场合。

五、选型与电路设计要点

  • 保持电流应大于系统最大正常工作电流,推荐留 20–30% 余量;Ihold=0.5A 适用于标称工作电流 ≤0.4A 的电路。
  • 考虑启动涌流:若存在较大浪涌电流(电机、开关电源启动),需确认该涌流不会在短时间内触发跳闸或选择更高 Ihold 的型号。
  • 功耗校核:按 P = I^2×R 计算器件稳态发热;例如 1A 时 P ≈ 150 mW,低于 Pd。实际热态受 PCB 散热影响,应在目标环境测评。
  • Imax 表示能承受的短时脉冲或事故峰值,非建议连续工作电流。

六、封装与安装建议

  • 1206 标准贴片封装,适合常规 SMT 回流焊;推荐按照制造商回流曲线和 PCB 热设计规范。
  • 布局上尽量靠近被保护的电源入口,缩短导线/走线长度以减小寄生电阻与感性尖峰。
  • 储存与焊接注意潮湿敏感度和回流温度峰值,避免超过材料耐受范围。

七、安全与可靠性提示

  • 建议在最终产品中进行实际温度与过流测试以确认动作点和耐久性。
  • 自恢复保险丝不能替代断路器或隔离开关,不用于需要明确断开触点的保护场合。
  • 对关键或安全相关系统,考虑并联/串联组合保护或配合快熔断器作为冗余保护方案。

总结:BSMD1206-050-24V 提供小尺寸、低压降、可重复恢复的过流保护,适用于空间受限的低压电子设备。选型时结合实际工作电流、启动浪涌与热管理进行验证,可在多种消费及工业应用中提高系统可靠性。若需生产级资料(曲线、回流建议、可靠性报告),建议向佰宏索取完整数据手册。

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