WMSIC Electronic Components

BHFUSE BSMD0805-110-6V BSMD0805

ModelBSMD0805-110-6V
Package0805
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0805-110-6V
Type
BHFUSE
Minimum package
4000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0805-110-6V
Electronic Component
1
Electronic Component
1.5mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.031g
Electronic Component
2.2mm
Electronic Component
1.2mm
Electronic Component
1
Electronic Component
300ms
Electronic Component
BM0228072333
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
600mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0805-110-6V 产品概述

一、产品概述

BSMD0805-110-6V 是佰宏(BHFUSE)推出的微型自恢复保险丝,封装尺寸为 0805(实际尺寸:长 2.2mm × 宽 1.5mm × 高 1.2mm)。该器件以聚合物正温度系数(PTC)材料为核心,能在短路或持续过流情况下自动限流并在故障解除后恢复导通,适合对体积、可靠性和可维护性有较高要求的小型电子产品。

二、主要技术参数

  • 额定耐压(Vmax):6 V
  • 最大冲击电流(Imax):40 A
  • 保持电流(Ihold):1.1 A(器件在该电流下长期通过而不跳闸)
  • 跳闸电流(Itrip):2.2 A(近似触发限流的参考值)
  • 额定功耗(Pd):600 mW
  • 初始状态阻值(Rmin):35 mΩ
  • 跳断后最大阻值(R1max):230 mΩ
  • 动作时间:约 300 ms(在规定过流条件下)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:0805(SMD)

三、产品特点与优势

  • 体积小、易于贴装:0805 封装兼容常见贴片工艺,适合自动贴装与回流焊接。
  • 自恢复保护:在过流/短路情况下自动限制电流,故障消除后可恢复,无需更换。
  • 快速动作:典型动作时间约 300 ms,可在短时间内限制峰值故障电流。
  • 低初始阻抗:Rmin 仅 35 mΩ,有利于降低正常工作下的功率损耗与发热。
  • 经工程验证的热电特性:在 -40 ℃ 至 +85 ℃ 环境下稳定工作。

四、典型应用场景

  • USB、移动电源与充电线路的过流保护(尤其是低压 6 V 以下系统)。
  • 手机、平板、电池管理模块(BMS)与便携式设备的短路防护。
  • 汽车电子低压子系统、车载信息娱乐和传感器供电线路(须按车规要求选型)。
  • 网络设备、电源管理模块和工业控制板上对通讯或辅助电源的保护。

五、选型与使用建议

  • 连续工作电流应小于保持电流 Ihold(1.1 A),建议在设计时预留余量(例如 70%–80% 的去率)以保证长期可靠性。
  • 当电路可能出现启动冲击或大电流脉冲时,核查 Imax(40 A)是否能承受该冲击,必要时加并联或使用其它保护器件配合。
  • 跳闸电流 Itrip(2.2 A)为触发参考值,实际动作与环境温度、脉冲宽度与封装散热条件有关;高环境温度会降低动作门槛。
  • 布局时避免将器件置于热源附近,确保良好散热路径;采用推荐的 0805 焊盘布局与回流焊工艺(控制焊接温度以免过热)。
  • 不建议用作需要明确熔断指示或需要快速完全断开的场景(PTC 为限流型而非断开型)。

六、储存与可靠性提示

  • 储存环境建议干燥、无腐蚀性气体、温度与湿度受控。长时间潮湿储存可能影响焊接性。
  • 多次或长期处于跳闸状态后,器件内部阻值会增加(跳断后阻值上限 R1max 为 230 mΩ),在关键电路中应评估多次动作后的影响并考虑更换。
  • 在汽车或工业等严苛应用需评估温度循环、振动与湿热可靠性试验结果,并按实际规范进行认证与测试。

总体而言,BSMD0805-110-6V 适合对尺寸、自动恢复与成本敏感的低压过流保护场合。在选型与布局时应注意电流裕量与热管理,以确保长期稳定运行。

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