WMSIC Electronic Components

BHFUSE BSMD0805L-200 BSMD0805L

ModelBSMD0805L-200
Package0805
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0805L-200
Type
BHFUSE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0805L-200
Electronic Component
1
Electronic Component
1.8mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.033g
Electronic Component
2.5mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
8s
Electronic Component
BM0226580898
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
1W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0805L-200 产品概述

一、产品简介

BSMD0805L-200 是佰宏(BHFUSE)推出的一款 0805 封装自恢复保险丝(PPTC),用于对低电压电源线路与口线提供过流、短路保护。器件体积小、响应稳定、可在故障解除后自动复位,适配表面贴装 SMT 生产流程,适合消费电子、通信与便携设备等场景。

二、主要参数

  • 尺寸(封装):0805,长×宽×高 = 2.5 mm × 1.8 mm × 1.0 mm
  • 额定电压 Vmax:6 V
  • 保持电流 Ihold:2 A(器件在正常工作时应小于此值)
  • 跳闸电流 Itrip:4 A(典型)
  • 最大/冲击电流 Imax:50 A(短时允许峰值)
  • 初始电阻 Rmin:4 mΩ(未动作状态)
  • 跳断后阻值 R1max:45 mΩ(动作后恢复态阻值上升)
  • 动作时间:约 8 s(在接近跳闸电流条件下典型动作时间)
  • 功率耗散 Pd:1 W(额定耗散功率)
  • 工作温度范围:-40 ℃ ~ +85 ℃

三、工作原理与电气特性

该器件为聚合物自恢复保险丝(PPTC),在正常电流下保持低阻(约 4 mΩ),当电流超过跳闸阈值并持续一定时间时,内部温度上升引起阻值迅速增大(动作后阻值可达 ≤45 mΩ),从而限制电流保护下游电路。短时冲击电流可承受到 50 A,但长期通过应受限于 Ihold 与 Pd。动作时间受环境温度、线路散热与超流幅值影响。

四、封装与安装

0805 表贴封装,兼容常规回流焊工艺。建议贴片时靠近被保护电源入端/ connector 处安装以缩短保护回路路径;焊盘热量设计应兼顾焊接可靠性与过流时的热散逸。使用标准 0805 焊盘尺寸并遵循厂商回流曲线。

五、典型应用

  • USB、Type-C 和其他低压外设接口过流保护
  • 电池保护与充电管理系统的输入侧保护
  • LED 驱动、便携式设备主电源保护
  • 通信设备和模块的电源分支保护

六、设计与选型注意事项

  • 选择 Ihold 要大于正常工作电流,且 Itrip 应高于设备瞬态启动电流以避免误动作;若有大启动浪涌,需评估 Imax 能否承受短时峰值。
  • 工作环境温度对 Ihold/ Itrip 有显著影响,高温下保持电流会降低,应按最高环境温度下的性能留有余量。
  • 电压等级 6 V 适用于低压系统,若系统电压更高需选用更高耐压器件。
  • 动作后阻值上升可能引起电压降,需评估对下游电路的影响。

七、可靠性与测试建议

在量产前建议完成:初始及动作后电阻测试、保持/跳闸电流测试、反复复位循环测试、环境温度与湿热老化测试以及焊接热稳性验证。对关键产品可开展过流下降曲线(I–t)和短路承受能力的系统级评估。

总结:BSMD0805L-200 以小尺寸、高承受峰值和自动复位特性,适用于多种低压短路/过流保护场景。正确的选型与布局、以及针对工作温度与浪涌的验证,可确保系统保护可靠且稳定。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.