WMSIC Electronic Components

BHFUSE BSMD0805-020-15V BSMD0805

ModelBSMD0805-020-15V
Package0805
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0805-020-15V
Type
BHFUSE
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0805-020-15V
Electronic Component
1
Electronic Component
1.5mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.022g
Electronic Component
2.2mm
Electronic Component
0.9mm
Electronic Component
1
Electronic Component
20ms
Electronic Component
BM0231067993
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
15V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0805-020-15V 自恢复保险丝(BSMD0805-020-15V — BHFUSE)

一、产品简介

BSMD0805-020-15V 为佰宏(BHFUSE)出品的表面贴装自恢复保险丝(PPTC),封装尺寸为0805(长度约2.2mm、宽度1.5mm、高度0.9mm)。器件在过流时自动增大阻抗以限制电流,故障消除后恢复低阻态,适合对短路和过流有自动保护需求的小型电子产品。

二、主要技术参数

  • 型号:BSMD0805-020-15V
  • 封装:0805(SMD)
  • 工作温度:-40℃ ~ +85℃
  • 容许功耗(Pd):500 mW
  • 额定耐压(Vmax):15 V
  • 初始态阻值(Rmin):0.5 Ω(500 mΩ)
  • 跳断后最大阻值(R1max):3.5 Ω
  • 保持电流(Ihold):200 mA
  • 跳闸电流(Itrip):500 mA
  • 最大连续电流(Imax):40 A(瞬态/浪涌能力,具体取决于脉冲宽度)
  • 动作时间:20 ms
  • 外形尺寸:约 2.2 × 1.5 × 0.9 mm

三、产品特性与优势

  • 小型化封装,便于高密度PCB布置;
  • 自恢复功能,消除一次性熔断器更换的维护需求;
  • 快速动作(20ms)可有效保护下游器件免受短路冲击;
  • 低初始阻值,保证正常工作时压降和功耗较小;
  • 适用于低压(≤15V)系统的过流保护。

四、典型应用场景

  • 移动设备与可穿戴终端的接口保护(USB、充电口等);
  • 家用及消费类电子小模块电源保护;
  • 通信、I/O接口、板上外设保护;
  • 小电流传感器、低功耗模块与备用电路保护。

五、选型与使用建议

  • 正确选型需满足 Ihold < 正常工作电流 < Itrip,典型建议工作电流应明显低于 Itrip(留有余量);
  • 注意环境温度对 Ihold/Itrip 的影响,高温会降低器件承载能力,应参照厂方温升曲线做热降额;
  • 系统电压不得超过 15 V;若存在大幅度浪涌或高能短路,应同时配合熔断器或限流电阻等保护元件。

六、封装与焊接建议

  • 建议使用标准0805焊盘设计,保持良好散热路径;
  • 采用推荐回流焊工艺,遵循元件耐温限制与PCB工艺规范;
  • 焊接后建议进行电气测试以确认初始阻值在规格范围内。

七、品质与可靠性注意事项

  • 在设计中考虑长期工作温升与热循环对器件参数的影响;
  • 对频繁触发或长时间处于高阻态的应用,应评估器件寿命与可靠性;
  • 采购时建议向供应商索取完整数据手册与可靠性测试报告,便于做更精确的热与电性能评估。

如需我帮忙按照您的PCB尺寸给出推荐焊盘尺寸或评估在具体工作电流/温度下的安全裕量,可提供更详细工作条件以便计算与建议。

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