WMSIC Electronic Components

BHFUSE BSMD0402L-050 BSMD0402L

ModelBSMD0402L-050
Package0402
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0402L-050
Type
BHFUSE
Minimum package
10000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0402L-050
Electronic Component
1
Electronic Component
0.65mm
Package
0402
Electronic Component
Resettable Fuse
Electronic Component
0.016g
Electronic Component
1.15mm
Electronic Component
0.6mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0228072368
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0402L-050 产品概述

一、产品简介

BSMD0402L-050 是 BHFUSE(佰宏)推出的一款微型自恢复保险(PTC resettable fuse),采用 0402 封装,专为空间受限的移动设备和精密电子系统提供过流保护而设计。器件在异常过流或短路情况下快速动作并限制电流,故障消除后可自动恢复,适合对体积和可靠性有较高要求的电路保护应用。

二、主要特性

  • 初始态低阻抗:典型初始阻值 Rmin = 40 mΩ,保证正常供电时压降和热耗小。
  • 跳闸后高阻态:跳闸后阻值 R1max ≤ 400 mΩ,有效限制通过电流。
  • 明确动作特性:动作时间约 100 ms,跳闸电流 Itrip = 1 A,保持电流 Ihold = 500 mA。
  • 优异的电气承受能力:最高耐压 Vmax = 6 V,最大瞬态允许电流 Imax = 40 A。
  • 宽工作温度范围:-40 ℃ 至 +85 ℃,适用多种环境条件。
  • 热稳定性好:最大消耗功率 Pd = 500 mW,体积小而热容适中。

三、关键电气参数

  • 初始态阻值(Rmin):40 mΩ
  • 跳断后阻值(R1max):400 mΩ(最大)
  • 保持电流(Ihold):0.5 A
  • 跳闸电流(Itrip):1 A
  • 最大电流(Imax):40 A(瞬态冲击)
  • 最大耐压(Vmax):6 V
  • 动作时间:100 ms
  • 最大耗散功率(Pd):500 mW

四、典型应用场景

  • USB、Type-C 接口和数据/电源插口的过流防护
  • 移动电源、便携式音频、蓝牙设备等消费类电子电源管理
  • IoT 终端、传感器节点与低功耗模块的输入保护
  • 小型电池管理、充电线路保护与模块化电源板设计

五、封装与机械参数

  • 封装:0402(微型 SMD)
  • 长度:1.15 mm;宽度:0.65 mm;高度:0.6 mm
    该微小尺寸便于高密度 PCB 布局,但对丝印、回流和检验提出更高要求。

六、使用与焊接建议

  • 焊接工艺:建议采用标准无铅回流工艺,控温曲线需符合元件耐热性,避免超时高温造成参数漂移。
  • 版图建议:焊盘应适当加宽并留有热散逸空间,避免周围器件过密导致热累积。
  • 散热与布局:在高温或连续高负载场合,应留意周围元件散热,必要时进行热仿真或增加间距。
  • 选型注意:根据工作电流与预期短路能量选择 Ihold / Itrip 匹配的型号,留有余量以提高可靠性。
  • 环境与可靠性:长期在高温或频繁触发的工况下,器件老化会影响跳闸特性,建议在设计时考虑冗余或定期验证。

如需进一步的电流-时间曲线、热阻数据或推荐 PCB 尺寸图,可提供以便完成详细设计与可靠性评估。

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