WMSIC Electronic Components

BHFUSE BSMD1206-012-60V BSMD1206

ModelBSMD1206-012-60V
Package1206
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1206-012-60V
Type
BHFUSE
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1206-012-60V
Electronic Component
1
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.032g
Electronic Component
1
Electronic Component
1s
Electronic Component
BM0226603371
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
60V
Power(Pd)
600mW
Current(Imax)
40A
Electronic Component
Electronic Component
Electronic Component
3500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1206-012-60V 产品概述 — BHFUSE(佰宏)

一、产品简介

BSMD1206-012-60V 是佰宏(BHFUSE)推出的 1206 封装贴片自恢复保险元件(PolySwitch/PTC 样式),用于对电子电路中异常过流进行自动限流与自恢复保护。该型号面向中低电流、60V 以下工作电压的电路保护需求,适合便携设备、通信模组、消费电子与各种线缆/接口保护应用。

二、主要参数与意义

  • 跳断后阻值 R1max:13 Ω(过流触发并冷却后恢复态的最大阻值,限制故障电流)
  • 初始态阻值 Rmin:1.6 Ω(常态下的低阻抗,保证正常工作时压降最小)
  • 耐压 Vmax:60 V(允许施加的最大直流电压)
  • 跳闸电流 Itrip:290 mA(在该电流附近器件进入高阻态并限制电流)
  • 保持电流 Ihold:120 mA(在此及以下电流下器件保持低阻态,不会触发)
  • 最大电流 Imax:40 A(短时浪涌承受能力,上限用于瞬态冲击情况下的机械/电气完整性评估)
  • 动作时间:1 s(典型条件下达到保护状态所需时间,实际与环境温度和电流大小相关)
  • 消耗功率 Pd:600 mW(器件在常态或过渡态时的最大允许功耗或热耗散参考值)
  • 工作温度:-40 ℃ ~ +85 ℃(允许的环境温度范围)
  • 封装:1206 表贴,适用于自动贴装与回流焊工艺

三、主要特点

  • 小体积(1206)方便高密度 PCB 设计与自动化生产;
  • 自恢复,故障解除后无需更换,降低维护成本;
  • 低初始阻值(1.6 Ω)保证正常工作压降低;
  • 明确的保持/跳闸电流(120 mA / 290 mA)便于按设计电流进行选型;
  • 对短时浪涌有较强承受能力(Imax 40 A),适配含突发电流的系统。

四、典型应用场景

  • USB、串口接口与通信端口过流保护;
  • 便携式设备(电池供电模块、充电电路)短路保护;
  • 家电控制板、传感器模块和工业控制中的回路过流限制;
  • 电源输入防护、线缆保护以及汽车电子(低压系统,需按温度/认证核实)。

五、封装与安装建议

  • 推荐采用标准 1206 焊盘布局,配合厂商推荐的焊膏量与回流曲线以保证良好焊点;
  • 避免将器件布置在持续高散热元件紧邻处,以免环境温度偏高导致误触发;
  • 对于靠近热源或高电流回路的布局,可增加铜面积帮助散热或通过热隔离降低误动作概率;
  • 在高浪涌环境应在 PCB 设计中留意旁路/限流元件配合使用,避免频繁触发导致热累积。

六、选型与使用注意事项

  • 正常工作电流应低于 Ihold(120 mA),若工作电流介于 Ihold 与 Itrip,器件可能在温度波动或长期运行中发生偶发触发;
  • Itrip(290 mA)为触发参考,实际动作时间与电流大小密切相关,超过 Itrip 多倍时动作时间显著缩短;
  • Pd(600 mW)为热耗散参考,设计中应保证器件在最大工作条件下的散热路径,避免过热影响寿命与性能;
  • Imax(40 A)通常表示短时冲击承受能力,不等同于长期通过能力;长期电流以 Ihold 为准;
  • 若需要认证(如 UL)或在汽车等严苛环境使用,请向厂商确认具体认证状态与耐久测试结果。

七、存储与可靠性

  • 存储环境建议避免高湿高温,长期库存应遵循厂商湿敏等级与再流焊前的烘干处理要求;
  • 建议在最终应用中进行过流触发-恢复循环测试以验证在目标工况下的可靠性与寿命。

如需更详细的电气曲线(I–T 曲线、温度对 R 和 Itrip 的影响)、回流焊工艺参数或具体封装尺寸图纸与推荐焊盘,请告知,我可基于厂方资料为您获取并整理。

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