WMSIC Electronic Components

BHFUSE BSMD1812-020-30V BSMD1812

ModelBSMD1812-020-30V
Package1812
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1812-020-30V
Type
BHFUSE
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1812-020-30V
Electronic Component
1
Electronic Component
3.41mm
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.051g
Electronic Component
4.73mm
Electronic Component
1.1mm
Electronic Component
1
Electronic Component
40ms
Electronic Component
BM0229474031
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
30V
Power(Pd)
800mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1812-020-30V 产品概述

一、产品简介

BSMD1812-020-30V 是佰宏(BHFUSE)生产的一款表面贴装自恢复保险(PPTC/自恢复型聚合物保险元件),封装规格为1812(长4.73mm×宽3.41mm×高1.1mm)。该器件用于电路过流保护,触发后电阻迅速增大以限制电流,故障解除后自动恢复原始低阻状态,适合多种消费电子与工业低压电源保护场景。

二、主要电气与机械参数

  • 耐压 (Vmax):30 V
  • 最大电流 (Imax):40 A(极限/短时能力,详见厂方曲线)
  • 保持电流 (Ihold):200 mA(在规定环境下不动作)
  • 跳闸电流 (Itrip):400 mA(典型动作阈值)
  • 消耗功率 (Pd):800 mW(用于热设计参考)
  • 初始态阻值 (Rmin):0.35 Ω
  • 跳断后阻值 (R1max):≤5 Ω
  • 动作时间:40 ms(在规定超载条件下)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 尺寸:4.73 × 3.41 × 1.10 mm,1812 封装

三、性能特点与工作原理

该器件在低电阻状态下允许正常工作电流通过;当电流超过 Itrip 时,器件内部温度上升,聚合物材料发生电阻增大,限制通过电流以保护下游电路。动作时间短(典型40ms),初始阻值低(Rmin=350mΩ)可减少功率损耗;跳断后阻值显著上升(R1max≤5Ω),有效降低故障电流。自恢复特性可在故障解除并冷却后恢复低阻态,适合重复保护需求。

四、典型应用场景

适用于各类低压电源保护,如 USB 供电接口、充电器与电源适配器、便携设备主供电、板级电源保护、通信设备与消费类电子。由于工作温度及额定电流特性,不建议在高温严苛的动力总成近发动机舱等极端环境长期使用,若用于汽车应确认车规级要求与温度裕量。

五、选型与使用建议

  • 审核 Ihold 与 Itrip 是否匹配实际工作电流与短时浪涌;若存在较大浪涌(如启动电流),应考虑适当余量或并联设计,并参考厂方时间-电流特性曲线。
  • Imax 标注为 40A,应视为极限/短时承受能力,长期连续大电流需谨慎。
  • 布局时留意散热与周围器件热耦合,Pd=800mW 为热设计参考值;在高环境温度下需进行降额(derating)。
  • 兼容标准回流焊工艺,但建议参考佰宏推荐的焊接温度曲线与预热参数,避免过热损伤。
  • 设计时考虑触发后恢复时间与系统重连策略,必要时配合限流电路或监控逻辑共同保护。

如需更详细的时间-电流曲线、热阻模型或推荐PCB封装(Land Pattern),建议索取佰宏产品datasheet以获得完整规范与测试数据。

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