WMSIC Electronic Components

BHFUSE BSMD0805-003-30V BSMD0805

ModelBSMD0805-003-30V
Package0805
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0805-003-30V
Type
BHFUSE
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0805-003-30V
Electronic Component
1
Electronic Component
1.5mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.025g
Electronic Component
2.2mm
Electronic Component
0.9mm
Electronic Component
1
Electronic Component
1s
Electronic Component
BM0231067996
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
30V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0805-003-30V 产品概述

一、产品简介

BSMD0805-003-30V 为佰宏(BHFUSE)推出的微型表面贴装自恢复保险元件(SMD复位式PTC),封装规格为0805(长2.2mm × 宽1.5mm × 高0.9mm)。器件额定耐压30V,适用于低电压直流保护场合,对电路过流具有快速响应和自恢复能力。

二、主要电气参数及其意义

  • 耐压(Vmax):30V,适用至30V直流电源保护;
  • 最大电流(Imax):20A,表示器件在短时峰值过流情况下能承受并安全中断或限制的能力;
  • 保持电流(Ihold):30mA,长期通过而不动作的最大电流,应保证正常工作电流低于此值;
  • 跳闸电流(Itrip):90mA,达到该电流水平时器件将在典型条件下开始进入高阻态;
  • 功耗(Pd):500mW,为器件在工作时的热耗限制,设计时需考虑散热与环境温升;
  • 初始态阻值(Rmin):6Ω,跳断后阻值(R1max):50Ω,说明动作后电阻显著增大以限制故障电流;
  • 动作时间:约1s(取决于过流倍数与环境),工作温度范围:-40℃~+85℃。

三、典型应用场景

适用于USB端口、传感器供电、智能家居、物联网终端、便携电子及其它低压直流电子设备的过流和短路保护,特别适合空间受限且需要可恢复保护的电路板设计。

四、设计与选型建议

  • 正常工作电流应显著低于Ihold以避免误动作;针对较大浪涌电流,应确认Imax承受能力与动作时间;
  • 考虑环境温度与布局热耦合,器件的Pd和周围散热条件直接影响动作行为;
  • 贴片布局时应预留足够铜面以利散热,保证回流焊温度曲线与0805贴片工艺相匹配;
  • 若电路有短时高浪涌(如电机启动),需评估是否需并联限流元件或选用更高Ihold规格。

五、封装、可靠性与使用注意

0805小尺寸适配自动贴装与回流工艺,提供对电路板的空间节省。使用时请注意焊接工艺参数与清洁度,避免长时间超温或机械应力。器件具有自恢复特性,但在重复严重故障下仍可能老化,应结合系统诊断与保护策略。若需批量采购或获取完整规格书,请联系佰宏(BHFUSE)或其授权分销渠道。

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