Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BHFUSE BSMD0603L-300 BSMD0603L
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BHFUSE BSMD0603L-300
- Type
- BHFUSE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BHFUSE
- Electronic Component
- BSMD0603L-300
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- 5s
- Electronic Component
- BM0264819721
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 6V
- Power(Pd)
- 500mW
- Current(Imax)
- 50A
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSMD0603L-300 产品概述
一、产品简介
BSMD0603L-300（品牌：BHFUSE / 佰宏）是一款0603封装的表面贴装自恢复聚合物保险丝（PPTC），尺寸为0.06 x 0.03 英寸（1.5 x 0.8 毫米）。该器件为无铅、无卤并符合 RoHS 要求，专为微型化电子设备提供过流保护，兼容高温回流焊工艺。
二、主要电气参数
- 最大耐压（Vmax）：6 V
- 最大允许电流（Imax）：50 A（短时峰值）
- 保持电流（Ihold）：3 A（典型工作电流上限）
- 跳闸电流（Itrip）：5 A（触发过流保护）
- 功率消耗（Pd）：500 mW
- 初始态阻值（Rmin）：6 mΩ
- 跳断后阻值（R1max）：45 mΩ
- 动作时间：约 5 s（典型）
- 工作温度范围：-40 ℃ 至 +85 ℃
三、产品特性
- 响应迅速，能在过流条件下短时间内限制电流，保护电路及负载。
- 低初始阻抗，保证正常工作时的电压降和功耗最小化。
- 低剖面、微小封装，适合高密度 PCB 布局与便携设备。
- 兼容高温焊料和回流焊工艺，便于批量贴装生产。
- 符合环保规范（无铅、无卤、RoHS）。
四、典型应用场景
- 笔记本、台式机外围电源保护（USB、电池管理子线）。
- 手机及移动终端充电/数据线、电源分配保护。
- 外设、模块化电源、接口保护等需要微型过流自恢复保护的场合。
五、安装与使用建议
- 推荐采用标准0603贴片工艺进行回流焊，注意工艺曲线符合器件焊接温度要求。
- 在选择放置位置时尽量靠近被保护的端口或电源输入处，以减少导线或走线引入的非受控电流路径。
- 设计电路时按 Ihold 与 Itrip 值合理留有裕量，避免频繁误触发。
- 如需在高振动或严格机械环境使用，请在样机阶段进行可靠性验证。
六、可靠性与合规
BSMD0603L-300 提供稳定的一致性特性，具有重复自恢复能力；符合 RoHS 和无卤材料要求，适合消费类电子和工业级应用。为确保长期稳定性，建议在目标温度与电流应力下做寿命测试验证。
七、选型与订购建议
在选型时以 Ihold 和 Itrip 为首要依据，结合工作电压（≤6V）与允许短时峰值电流（最高可达50A）评估适配性。欲获得样品或批量订购信息，请联系 BHFUSE（佰宏）授权经销商并提供产品型号 BSMD0603L-300 与应用场景说明。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
