WMSIC Electronic Components

BHFUSE BSMD1206-005-60V BSMD1206

ModelBSMD1206-005-60V
Package1206
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1206-005-60V
Type
BHFUSE
Minimum package
3500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1206-005-60V
Electronic Component
1
Electronic Component
1.9mm
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.037g
Electronic Component
3.6mm
Electronic Component
1.2mm
Electronic Component
1
Electronic Component
1.5s
Electronic Component
BM0228072386
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
60V
Power(Pd)
600mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1206-005-60V 产品概述

一、产品简介

BSMD1206-005-60V 是 BHFUSE(佰宏)推出的一款 1206 封装自恢复保险丝(PTC),用于对小电流至中等瞬态过流事件的保护。器件在正常工作时呈低阻态,在超过设定跳闸电流时迅速升阻限制电流,故障消除后可自动回复初始阻值,适合对线路短路、误接或瞬态过流进行反复保护的应用。

二、主要技术参数

  • 封装:1206(SMD)
  • 外形尺寸:长度 3.6mm × 宽度 1.9mm × 高度 1.2mm
  • 初始态阻值(Rmin):3.6Ω
  • 跳断后最大阻值(R1max):50Ω
  • 额定耐压(Vmax):60V
  • 跳闸电流(Itrip):150mA
  • 保持电流(Ihold):50mA
  • 最大允许电流(Imax,瞬态):40A
  • 动作时间:1.5s(典型条件下)
  • 功率消耗(Pd):600mW
  • 工作温度范围:-40℃ ~ +85℃
  • 品牌:BHFUSE(佰宏)

三、产品特性

  • 小体积 SMD 1206 封装,适配自动贴装与回流焊工艺,便于在高密度电路板上布局。
  • 低初始阻值(3.6Ω),能在正常工作电流下保持较小的压降与热耗。
  • 明确的保持/跳闸电流点(Ihold 50mA / Itrip 150mA),便于设计中进行过流门限控制和选型。
  • 跳闸后阻值上升至最大 50Ω,可有效限制故障电流,减小系统损伤。
  • 支持高达 60V 的电压系统,适用于多种中低压线路保护。
  • 自恢复特性允许在故障清除后自动恢复,减少了人工更换与维护成本。

四、典型应用场景

  • USB、串口及弱电外设的过流保护(≤60V 系统)。
  • 工业控制、物联网节点、传感器模块等低功耗设备的输入端保护。
  • 电源管理板、防护接口与通信线路的短路/误接保护。
  • 可作为设备内部多个通道的小电流保护元件,与限流与熔断结构配合使用。

五、选型与使用建议

  • 常态工作电流应显著低于保持电流(Ihold = 50mA),以避免误跳闸;短时峰值电流可承受,但应小于器件瞬态上限(Imax = 40A)并控制时间长度。
  • 设计时需考虑环境温度对跳闸行为的影响,高温环境下器件更易触发,建议在高温条件下适当增加裕度。
  • 布局时建议将器件置于靠近电源入口或易发生短路的线路节点处,以发挥最快速保护效果并便于散热。
  • 与 PCB 回流焊兼容,建议按常规无铅回流工艺进行焊接,但在实际工程中应先通过工艺验证(焊接温度与时间窗口)确认无性能退化。
  • 在产品验证阶段,应进行过流动作、恢复次数和温升测试,以评估在实际应用中的可靠性与寿命。

六、可靠性与包装

BSMD1206-005-60V 采用工业级材料,工作温度覆盖 -40℃ 至 +85℃,适应多数商用与工业环境。包装形式兼顾 SMT 自动化需求,适用于流水线批量贴装。建议在采购与设计时参照厂家最新数据手册和环境/测试条件,以保证最终系统的稳定性与合规性。

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