WMSIC Electronic Components

BHFUSE BSMD0603-010-6V BSMD0603

ModelBSMD0603-010-6V
Package0603
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0603-010-6V
Type
BHFUSE
Minimum package
4000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0603-010-6V
Electronic Component
1
Electronic Component
1.05mm
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.039g
Electronic Component
1.85mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
600ms
Electronic Component
BM0227636667
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0603-010-6V 产品概述

一、产品简介

BSMD0603-010-6V 是佰宏(BHFUSE)推出的一款 0603 封装自恢复保险(PTC resettable fuse / polyswitch),用于对低压电路中的过流和短路故障提供自动保护。该器件占板面积小、响应稳定、可自动复位,适合移动设备、接口保护和小功率电源模块等空间受限的场合。器件在过流时跳闸并限制电流,故障消除后恢复导通,无需更换。

二、主要技术参数

  • 封装:0603(尺寸符合贴片0603外形)
  • 长度:1.85 mm;宽度:1.05 mm;高度:1.00 mm
  • 初始态阻值 Rmin:900 mΩ(典型)
  • 跳断后阻值 R1max:8 Ω(最大)
  • 额定耐压 Vmax:6 V(最大工作电压)
  • 跳闸电流 Itrip:300 mA(典型)
  • 保持电流 Ihold:100 mA(典型)
  • 最大允许电流 Imax:40 A(请注意此为峰值/非持续热稳态评定)
  • 最大耗散功率 Pd:500 mW
  • 动作时间:600 ms(典型,从过流到进入跳闸状态所需时间)
  • 工作温度范围:-40 ℃ ~ +85 ℃

三、关键特性与优势

  • 小型化封装:0603 规格,便于高密度 PCB 布局,适配自动贴装与回流焊流程。
  • 可恢复保护:发生过流后自动进入高阻状态限制电流,故障清除后恢复低阻态,降低维护成本。
  • 低初始电阻:初始 0.9 Ω 的低电阻有助于减少正常工作时的压降与功耗。
  • 兼容 USB / 低压系统:6 V 的耐压适合 5 V USB / 通讯接口等低电压保护场景。
  • 明确的动作与保持电流:Ihold = 100 mA、Itrip = 300 mA,便于系统工程师按负载特性选择放置位置与数量。

四、典型应用场景

  • USB、UART、I2C 等接口保护,防止外部短路或模块异常对主板造成损害。
  • 便携式设备与物联网节点的电源线上过流保护,适合低功耗传感器与控制板。
  • 电池保护辅助电路(作为输入或输出的短路保护备选件)。
  • 工业控制低压模块、消费电子附件、小型充电器的输入侧保护。

五、设计与布局建议

  • 串联放置:将器件与被保护回路串联,靠近被保护端(如接口端口或电源入口),以缩短故障电流路径并提高保护效率。
  • 考虑功率与散热:器件额定 Pd = 500 mW,长时间接近或超过该耗散功率会引起温升并影响动作特性。设计时留出一定散热空间,避免靠近高热源元件。
  • 电流留余量:工作电流应设计在 Ihold(100 mA)以下;若系统存在短时大电流冲击,应评估冲击持续时间与动作时间(600 ms)是否会触发跳闸。
  • 测量阻值:Rmin 为 900 mΩ,推荐使用四端(Kelvin)测量避免导线接触电阻影响。

六、焊接与可靠性注意事项

  • 焊接工艺:支持常规回流焊工艺,遵循供应商提供的回流温度曲线和峰值时间,避免长时、高温烘烤。
  • 存储与环境:工作温度范围 -40 ℃ 至 +85 ℃,超出该范围可能影响器件特性与寿命。湿度敏感等级请参照出厂资料与回流前干燥处理规范。
  • 可靠性试验:建议在最终产品中进行温升、循环电流与浪涌能力测试,确认在实际工况下的动作与复位一致性。

七、选型与替代建议

  • 若系统工作电流接近或超过 Ihold(100 mA),应选用 Ihold 更高或 Itrip 更高的型号。
  • 对于需要更高耐压或更快动作时间的场合,可考虑其他封装或规格的自恢复保险或一次性熔断器(SMD fuse)。
  • Imax=40 A 通常表征瞬态承受能力,不应作为连续工作电流依据;系统保护设计应以 Ihold/Itrip 为主。

总结:BSMD0603-010-6V 在体积、自动复位与接口保护方面具有明显优势,适合用于 5 V 类低压、低功耗电路的过流保护。设计时应重点关注 Ihold 与 Itrip 的匹配、功耗散热和回流焊兼容性,确保在目标应用中实现可靠保护。若需完整数据表(包含典型曲线、回流工艺、封装图与可靠性测试报告),建议联系佰宏官方或查阅产品手册以获取更详尽资料。

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