WMSIC Electronic Components

BHFUSE BSMD1206L-300 BSMD1206L

ModelBSMD1206L-300
Package1206
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1206L-300
Type
BHFUSE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1206L-300
Electronic Component
1
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.039g
Electronic Component
1
Electronic Component
BM0229474023
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
1.2W
Current(Imax)
50A
Electronic Component
Electronic Component
Electronic Component
4000
Latching Current(Ihold)
3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1206L-300 产品概述

一、产品简介

BSMD1206L-300 是佰宏(BHFUSE)出品的一款表面贴装自恢复保险(PTC resettable fuse),1206 封装,针对电路短路和过流保护设计。器件在正常工作时阻值极低,遇到过流时通过温升使阻值迅速增大,从而限制电流并保护后端电路,故障消除后可自动恢复。

二、主要性能参数

  • 品牌:BHFUSE(佰宏)
  • 型号:BSMD1206L-300
  • 封装:1206(表面贴装)
  • 初始态阻值 Rmin:3 mΩ
  • 跳断后阻值 R1max:30 mΩ
  • 保持电流 Ihold:3 A
  • 跳闸电流 Itrip:6 A
  • 最大电压 Vmax:6 V
  • 最大允许电流 Imax:50 A(瞬态)
  • 最大耗散功率 Pd:1.2 W
  • 工作温度范围:-40 ℃ ~ +85 ℃

三、关键特性与优势

  1. 低初始阻值:3 mΩ 的初始阻值保证了在正常工作下对信号与供电线路的压降极小,适合对压降敏感的应用。
  2. 可恢复保护:过流保护后无需更换元件,降低维护成本并提高系统可靠性。
  3. 快速响应:6 A 跳闸设定可以在过流事件发生时迅速限制电流,保护下游器件。
  4. 宽温度范围:-40 ~ +85 ℃ 满足多环境使用要求。
  5. 大电流承受能力:规定的瞬态最大电流能力使其在瞬态冲击条件下更有余量。

四、典型应用场景

  • USB、电源接口、充电线路的短路与过流保护;
  • 汽车电子子系统(非高温区)中的保护元件;
  • 通信设备、工业控制模块、电池管理外围保护;
  • 需低压降、高可靠性保护的小型电子设备。

五、选型与使用注意事项

  1. 匹配电压与功耗:工作电压应低于 6 V,设计时考虑 Pd=1.2 W 的耗散能力与 PCB 散热条件。
  2. 电流裕量:Ihold 为 3 A,若电路工作电流接近或超过该值,应选择更高规格型号或并联设计(并联需谨慎考虑均流)。
  3. 温度影响:在高环境温度下 Itrip/Ihold 会发生偏移,应用时应进行温度下的实际验证。
  4. 过压/瞬态:对于高能量瞬态或雷击类事件,单元可能不足以吸收,应与抑制器件(TVS)配合使用。

六、封装与安装提示

1206 表面贴装易于自动贴装与回流焊,但需遵循制造商的焊接温度与时间建议,保证焊点可靠且避免过热引起性能漂移。PCB 设计时保留足够的散热铜箔并优化过孔布局,可提升器件稳态耗散能力与重复跳闸后的恢复性能。

如需样品、详细电气曲线或可靠性试验报告,可联系供应商获取完整数据手册以完成最终的电路验证与合规测试。

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