WMSIC Electronic Components

BHFUSE BSMD1206-016-60V BSMD1206

ModelBSMD1206-016-60V
Package1206
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1206-016-60V
Type
BHFUSE
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1206-016-60V
Electronic Component
1
Electronic Component
1.9mm
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.042g
Electronic Component
3.6mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
1s
Electronic Component
BM0231068005
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
60V
Power(Pd)
600mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1206-016-60V 产品概述

一、产品简介

BSMD1206-016-60V 为 BHFUSE(佰宏)推出的一款 1206 封装表面贴装自恢复熔断器(PPTC),专为中低电压电路的过流与短路保护设计。器件在正常工作电流下呈较低阻值,遭遇异常过流时在短时间内快速升阻限流,故障消除并冷却后可自动恢复至初始阻值,便于重复使用并降低维护成本。

二、主要技术参数

  • 最大耐压 (Vmax):60 V
  • 最大通过电流 (Imax):40 A(短时冲击能力)
  • 保持电流 (Ihold):160 mA(器件在该电流下长期不动作)
  • 跳闸电流 (Itrip):370 mA(典型动作阈值)
  • 功耗 (Pd):600 mW(稳态最大耗散)
  • 初始态阻值 (Rmin):1 Ω(典型)
  • 跳断后阻值 (R1max):6 Ω(动作后限流阻值上限)
  • 动作时间:约 1 s(超过 Itrip 时的典型跳闸时间)
  • 工作环境温度:-40 ℃ ~ +85 ℃
  • 外形尺寸:3.6 mm × 1.9 mm × 1.0 mm(1206 封装)

三、主要特性与优势

  • 小型 1206 表贴封装,适合集成化设计和自动贴装生产。
  • 自恢复型保护,无需更换熔断器即可连续保护多次故障情况。
  • 宽电压等级(60 V)适用于多种工业、通信与车载 12/24/48 V 系统。
  • 低静态功耗与明确的保持/跳闸参数,便于电路可靠性分析与选型。
  • 工作温度范围宽,能适应常见室温及轻工业环境。

四、典型应用场景

  • 通信设备与网通端口过流保护(交换机、基站模块)。
  • 工业控制与仪表电源输入保护(48 V 分布式电源系统)。
  • 便携式设备与外设接口保护(USB 扩展、电源适配器输入)。
  • 汽车电子辅助电路(非关键负载的短路/过流防护,需注意车辆环境规范)。

五、选型与使用建议

  • 在稳态条件下,确保电路最大工作电流低于 Ihold;若存在短时冲击,需确认 Imax 能承受该冲击幅值与时长。
  • 受环境温度影响,保持电流能力会下降,请根据工作温度做适当降额。
  • 跳闸后阻值上升会导致电压降与发热,应考虑散热与后级保护。
  • 对于对延迟或复位时间敏感的系统,需测试实际动作与冷却恢复曲线以保证系统行为可控。

六、封装与焊接注意

  • 采用 1206 PCB 派样,建议按厂家给定焊盘尺寸与回流曲线进行贴装与焊接。
  • 避免长时间高温回流或重复高温循环,以免影响器件电特性。
  • 存储与贴装前注意防潮处理,符合常规 SMT 工艺要求。

七、可靠性与测试建议

  • 在最终应用中建议做 I-V 曲线、动作时间测试与热滞回测试,以确认在目标温度与实际 PCB 条件下的性能。
  • 建议按产品寿命周期做多次动作恢复测试,评估跳闸后 R1max 的稳定性与长期重复性。

总结:BSMD1206-016-60V 是一款针对中小电流保护场合设计的表面贴装自恢复保险元件,凭借 60 V 耐压与 1206 小型封装,适用于通信、工业与车载辅助电路的过流保护。选型时需综合考虑工作温度、冲击电流与 PCB 热管理,以确保可靠运行。若需完整参数曲线、回流温度曲线或推荐 PCB 尺寸,请参考 BHFUSE 官方数据手册或联系供应商获取原始资料。

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