Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BHFUSE BSMD1206-010-30V BSMD1206
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BHFUSE BSMD1206-010-30V
- Type
- BHFUSE
- Minimum package
- 3500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BHFUSE
- Electronic Component
- BSMD1206-010-30V
- Electronic Component
- 1
- Electronic Component
- 1.9mm
- Package
- 1206
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.039g
- Electronic Component
- 3.6mm
- Electronic Component
- 1.2mm
- Electronic Component
- 1
- Electronic Component
- 500ms
- Electronic Component
- BM0229474036
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 30V
- Power(Pd)
- 600mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSMD1206-010-30V 产品概述
一、产品简介
BSMD1206-010-30V 是佰宏（BHFUSE）推出的一款表面贴装复位式自恢复保险（PTC/聚合物贴片式），封装为1206（3.6mm × 1.9mm × 1.2mm）。针对便携设备和工业控制中需要过流保护、短路保护且要求自动恢复的场景设计，能够在过载消除后自动恢复导通，减少维护和更换成本。
二、主要电气参数
- 最大耐压（Vmax）：30 V
- 最大电流（Imax）：40 A（短时峰值或限流能力参考）
- 保持电流（Ihold）：100 mA（在25°C下保持导通且不跳闸的最大稳态电流）
- 跳闸电流（Itrip）：250 mA（在规定时间内会进入高阻状态的电流水平）
- 最大功耗（Pd）：600 mW
- 初始态阻值（Rmin）：1.6 Ω（典型低阻态）
- 跳断后阻值（R1max）：15 Ω（进入限流后的高阻态）
- 动作时间：500 ms（从过流到进入高阻态的典型响应时间）
- 工作温度范围：-40℃ ~ +85℃
三、关键特性与优势
- 小尺寸1206封装，便于高密度PCB布局和自动化贴装；尺寸：3.6×1.9×1.2 mm。
- 明确的保持电流与跳闸电流区分，适合对电流阈值有严格要求的保护场景。
- 自恢复特性使设备在短时过载或偶发短路后能自动恢复，提升系统可靠性与可维护性。
- 宽工作温度范围适应消费电子、通信设备及一般工业环境。
四、典型应用
- 手机、耳机、平板等便携终端的USB、电源输入保护；
- IoT 节点、电源模块和基站设备的输入/输出线路保护；
- 工业控制器、仪表和外设接口的过流防护；
- 汽车电子低压子系统的辅助保护（需评估环境与车规要求）。
五、选型与注意事项
- 确认工作环境温度和附近器件发热对保持电流、跳闸电流的影响；高温会降低保持电流值。
- 若电路有长时间高峰电流或启动浪涌，需评估 Imax 与动作时间（500 ms）是否满足瞬态保护需求。
- 考虑初始阻值对电压降和功耗的影响，Rmin=1.6 Ω 在较大工作电流下会导致明显压降与发热。
- 若用于车规或高可靠场合，建议做老化与循环测试验证长期性能。
六、封装与安装建议
- 采用标准1206贴片工艺，推荐回流焊温度曲线遵循元器件厂商推荐；避免长时间高温暴露以防性能退化。
- 安装时保证良好焊盘设计与散热路径，必要时在PCB上增加铜箔面积以降低结温。
本产品适合寻求小型化、自动恢复式过流保护方案的设计场景。选型时请结合实际工作电流波形、环境温度和散热条件，必要时向供应商获取更详细的电气特性曲线与可靠性报告。若需进一步的等效电路图或样品评估建议，可提供具体应用电路以便给出更精确的建议。
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