WMSIC Electronic Components

BHFUSE BSMD1206C-2300T BSMD1206C

ModelBSMD1206C-2300T
Package1206
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1206C-2300T
Type
BHFUSE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1206C-2300T
Electronic Component
1
Electronic Component
1.6mm
Package
1206
Type
SMD Fuse
Electronic Component
Non-Resettable Fuse
Electronic Component
0.036g
Electronic Component
3.2mm
I2t
109
Electronic Component
1
Electronic Component
150A
Electronic Component
BM0231068014
Operating Temperature
55℃~+150℃
Voltage
32V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1206C-2300T 产品概述

一、产品简介

BSMD1206C-2300T 为 BHFUSE(佰宏)推出的一款贴片式限流保险丝(SMD fuse),封装规格为 1206(尺寸 3.2 mm × 1.6 mm),专为高电流、受限空间的 PCB 保护而设计。该型号额定电流为 30A,额定电压为 32V(AC / DC 均适用),适合对短路或过流事件进行快速可靠的断开保护。

二、主要性能指标

  • 类型:贴片式保险丝(SMD,1206 封装)
  • 型号:BSMD1206C-2300T
  • 品牌:BHFUSE(佰宏)
  • 额定电流:30A
  • 额定电压:32V(AC / DC)
  • 熔断 I2t:109 A²s(典型值,表征熔断能量)
  • 分断能力:150A(典型值)
  • 工作温度范围:-55℃ ~ +150℃
  • 外形尺寸:长度 3.2 mm,宽度 1.6 mm

以上参数为设计与选型的关键依据,具体电气性能曲线(如时间-电流特性、温度依赖的持流与熔断曲线)建议参照厂方完整 Datasheet。

三、产品特性与优势

  • 小型化封装:1206(3.2×1.6 mm)占板面积小,便于高密度布局与自动化贴装。
  • 高额定电流:30A 额定电流在小尺寸下提供了较高的电流承载能力,适合车载电子、消费类电源与电池保护等场景。
  • 可靠的熔断能量:I2t = 109 A²s,意味着在短路或过载时具有可预测的熔断性能,有助于保护下游元件和电路。
  • 良好的分断能力:150A 的分断能力可以在短路条件下安全切断高峰电流,降低器件和系统受损风险。
  • 宽温度范围:-55℃~+150℃,适应恶劣环境与高温工作条件,可靠性高。

四、典型应用场景

  • 电源入口与次级保护:用于开关电源、适配器、充电器的输出与输入保护。
  • 移动与便携设备:高电流电源管理、锂电池保护电路中的过流保护。
  • 通信与数据接口:Type-C/USB 电源线及数据线的过流保护(需确认系统最大电压与分断要求)。
  • 工控与仪器:为低压大电流负载(如继电器、马达驱动等)提供保护。
  • 车载电子(12V/24V):在 32V 额定电压下可用于大多数车载低压系统,但需按车规要求评估耐振动、冲击与可靠性。

五、PCB 布局与焊接建议

  • 放置位置:尽量靠近受保护电源入口或负载端,以最小化未保护导线长度,减少发热与反演电流路径。
  • 焊盘设计:建议参考厂方推荐焊盘尺寸,保证足够焊膏覆盖以获得可靠的焊接强度与热传导。
  • 回流焊兼容性:作为贴片件,适配常规回流焊流程;具体回流曲线(升温速率、峰值温度、停留时间)应以生产和元件 Datasheet 为准,避免超出元件热容限值。
  • 散热与去耦:在大电流持续工作时,周边铜箔面积与过孔应设计为良好散热路径,必要时配合散热铜柱或加宽导线。

六、选型与使用注意事项

  • 电流选择:额定 30A 表示在标准环境温度下的持续载流能力;实际应用中应考虑环境温度、散热条件与 PCB 降额规则,必要时选择更高额定值或并联设计(并联需谨慎,需控制均流)。
  • 耐压要求:本型号额定电压 32V,适用于低压系统;不适合高于其额定电压的场合。
  • 分断能力:150A 分断能力适用于多数短路场景,但在极端短路或高能量系统(如大电池组)中仍需评估是否满足系统保护需求。
  • 环境适配:虽然工作温度范围宽,但长期在高温环境中工作会影响寿命与触发特性,建议执行温升验证与老化试验。
  • 测试验证:在量产前进行实际电路的热仿真、过流触发测试与可靠性循环试验,确认在目标工况下的行为稳定。

七、包装与储存

  • 作为 SMD 元件,BSMD1206C-2300T 通常以带装(tape & reel)方式供货,方便自动贴装生产线使用。
  • 储存环境应避免潮气、高温与直接阳光照射,按常规 SMT 元件要求进行防潮措施(如需回流焊,遵循厂方干燥处理建议)。

总结:BSMD1206C-2300T 是一款面向高密度 PCB 的小型高电流贴片保险丝,以其 30A 额定电流、32V 额定电压、109 A²s 的熔断能量与 150A 的分断能力,适用于多种低压大电流保护场景。最终选型与应用请以厂方 Datasheet 为准,并结合实际电路的热与电特性进行验证。若需更详尽的时间-电流特性曲线或可靠性数据,可向佰宏技术支持索取完整技术资料。

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