WMSIC Electronic Components

BHFUSE BSMD0805-035-6V BSMD0805

ModelBSMD0805-035-6V
Package0805
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0805-035-6V
Type
BHFUSE
Minimum package
5000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0805-035-6V
Electronic Component
1
Electronic Component
1.5mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.028g
Electronic Component
2.2mm
Electronic Component
1.1mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0228088613
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0805-035-6V 自恢复保险丝(PPTC)产品概述

一、产品简介

BSMD0805-035-6V 是佰宏(BHFUSE)出品的一款贴片自恢复保险丝(PPTC),封装为0805,尺寸为长2.2mm×宽1.5mm×高1.1mm。该器件用于过流保护,遇过流或短路时通过升温增大阻值、限制电流,从而保护电路元件;故障解除并冷却后恢复低阻状态,适用于需要重复自恢复保护的小型电子设备和便携式电源线。

二、主要电气参数

  • 额定耐压(Vmax):6 V(工作电压不得超过此值,适用于低压系统)
  • 最大通过电流(Imax):40 A(短时浪涌能力,须结合应用中浪涌时长评估)
  • 保持电流(Ihold):350 mA(在25°C或指定条件下长时间通过不动作的最大电流)
  • 跳闸电流(Itrip):750 mA(典型情况下在100 ms 动作时的电流阈值)
  • 动作时间:100 ms(在达到Itrip时的参考动作时间)
  • 初始态阻值(Rmin):200 mΩ(常温、未动作时的典型最小阻值)
  • 跳断后阻值(R1max):1.2 Ω(动作后限制电流时的最大阻值)
  • 消耗功率(Pd):500 mW(在规定条件下的最大持续功耗)
  • 工作温度范围:-40℃ ~ +85℃

三、封装与机械特性

  • 封装:0805贴片封装
  • 外形尺寸:2.2 mm × 1.5 mm × 1.1 mm
    适合SMD贴装工艺,兼容常见的回流焊流程。建议参照厂方推荐的PCB焊盘尺寸与回流温度曲线以保证焊接可靠性。

四、典型应用场景

  • USB、OTG、充电接口过流保护(需确认总线电压≤6V)
  • 电池组分支、便携式设备电源保护
  • 摄像头、蓝牙模块、电源转换模块的短路/过流防护
  • LED驱动小功率支路保护、通信设备低压电源保护

五、选型与设计注意事项

  • 电压限制:Vmax仅6V,不能用于12V或更高电压系统。
  • 电流裕度:推荐工作电流显著低于Ihold(一般采取≤80% Ihold 的设计准则),并考虑环境温度对Ihold的影响(高温下保持电流会下降)。
  • 浪涌能力评估:Imax=40A为短时能力,具体允许的浪涌幅度与时间需查阅完整datasheet的Pulse或Surge曲线;长时间高于Ihold会导致动作。
  • 功耗与温升:Pd为500mW,为持续功耗上限。实际使用时需留意功耗产生的热量是否会导致周边器件受热。
  • 多路并联:若需更大持续电流,建议采用并联多只PPTC,但需注意均流问题与动作一致性。

六、封装贴装与可靠性建议

  • 遵循供应商推荐的焊盘设计与回流曲线,避免过热或冷焊。
  • 回流后建议进行外观与电气测试(初始阻值检测)。
  • 存储环境应避免潮湿和高温,使用前按MSL等级处理(如有)。
  • 频繁触发会加速材料老化,影响恢复特性与动作阈值,应尽量定位并消除根本故障。

七、采购与替代

  • 型号:BSMD0805-035-6V(BHFUSE/佰宏)
  • 采购时确认完整datasheet、包装方式及出货检验报告。
  • 替代选型时需匹配关键参数:Vmax、Ihold、Itrip、封装尺寸与功耗等级,并优先选择同等级的可靠品牌或验证件。

总结:BSMD0805-035-6V 是一款适用于低压小电流保护的0805自恢复保险丝,体积小、可重复自恢复,适合消费电子和便携设备中的低压回路保护。设计时需重点考虑电压限制、环境温度对动作特性的影响及浪涌能力匹配。若需更详细的温度-电流曲线、脉冲能力或回流焊建议,请索取完整datasheet。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.