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BHFUSE BSMD1206-035-33V BSMD1206
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BHFUSE BSMD1206-035-33V
- Type
- BHFUSE
- Minimum package
- 3500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BHFUSE
- Electronic Component
- BSMD1206-035-33V
- Electronic Component
- 1
- Electronic Component
- 1.9mm
- Package
- 1206
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.076g
- Electronic Component
- 3.6mm
- Electronic Component
- 1mm
- Electronic Component
- 1
- Electronic Component
- 100ms
- Electronic Component
- BM0229474035
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 33V
- Power(Pd)
- 600mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSMD1206-035-33V 产品概述
一、产品简介
BSMD1206-035-33V 为 BHFUSE（佰宏）出品的1206封装自恢复保险（PPTC），针对中低电流保护场景设计。器件尺寸3.6 × 1.9 × 1.0 mm，适合贴片SMT装配，可在过流时快速限制电流并在故障消除后自动恢复，便于重复使用和减少维护成本。
二、主要电气参数
- 最高工作电压（Vmax）：33 V
- 最大承受电流（Imax）：40 A（短时峰值）
- 保持电流（Ihold）：350 mA（器件在规定温度下长期通过而不动作的电流）
- 跳闸电流（Itrip）：750 mA（典型动作触发电流）
- 标称功耗（Pd）：600 mW（评估热平衡和版面散热需求）
- 初始态阻值（Rmin）：0.25 Ω
- 跳断后阻值（R1max）：1.5 Ω
- 动作时间：100 ms（在规定过流条件下的响应时间）
三、机械与环境特性
- 封装：1206 SMT
- 尺寸：3.6 × 1.9 × 1.0 mm
- 工作温度范围：-40 ℃ 至 +85 ℃
适合消费电子、通信接口和工业控制等受限空间应用，环境耐受性良好。
四、典型电气行为与计算示例
- 在保持电流下的电压降约为 V = I × R ≈ 0.35 A × 0.25 Ω ≈ 88 mV，功耗约 0.031 W，远低于 Pd。
- 在跳闸电流时（0.75 A），若仍按初始阻值计算，器件会快速升温并在100 ms内进入高阻态，从而将电流限制到安全值。跳断后阻值可达1.5 Ω，从而显著降低通过电路的电流。
注意：实际动作行为受环境温度、PCB散热和邻近器件影响，应在目标系统中做曲线验证。
五、应用场景
适用于USB/串口外围保护、板级电源支路、摄像头模块、路由器与消费类产品的短路/误接保护，以及需要可恢复保护且空间受限的场合。
六、布局与焊接建议
- 建议将器件靠近电源输入或被保护负载布置，以最快限定故障电流。
- PCB焊盘和铜箔面积会影响器件散热：较大铜箔有利散热但会提高动作电流，设计时需权衡并在样机上验证。
- 采用标准SMT回流焊工艺，遵循厂商推荐的回流曲线以保证可靠焊接。
七、选型与使用要点
- 工作电流应低于 Ihold，且考虑温升和长期漂移，建议留至少20–30%裕量。
- 设计时考虑到 Imax 为短时峰值能力，不代表可长期承受该电流。
- 在高环境温度下，保持电流能力会下降，需要适当降额。
八、可靠性与测试建议
在产品开发阶段进行典型的过流-时间（I-t）测试、热循环和实际系统验证，确认在目标版面和温度条件下的动作点与恢复性能。必要时与厂家沟通获取详细的曲线和样品测试支持。
如需器件数据表、封装图或回流曲线，可以提供具体需求，我可协助整理并给出PCB封装建议。
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