WMSIC Electronic Components

BHFUSE BSMD1812-050-24V BSMD1812

ModelBSMD1812-050-24V
Package1812
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1812-050-24V
Type
BHFUSE
Minimum package
1500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1812-050-24V
Electronic Component
1
Electronic Component
3.41mm
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.105g
Electronic Component
4.73mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
150ms
Electronic Component
BM0231049793
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
24V
Power(Pd)
800mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1812-050-24V 自恢复保险丝产品概述

一、产品简介

BSMD1812-050-24V(BHFUSE/佰宏)是一款1812封装的表面贴装自恢复保险丝(PTC resettable fuse),用于在过流或短路情况下保护线路与器件。器件尺寸为长4.73mm、宽3.41mm、高1.00mm,适合常见的PCB贴装与紧凑空间电源保护设计。最大耐压24V,适用于24V及以下的直流电源环境。

二、主要电气参数

  • 初始态阻值 Rmin:150 mΩ(典型初始电阻,影响压降)
  • 跳断后阻值 R1max:1.4 Ω(复位后处于高阻态以限制电流)
  • 保持电流 Ihold:500 mA(在规定温度下能长期承受的电流)
  • 跳闸电流 Itrip:1 A(在规定时间内开始进入高阻态的电流)
  • 最大电流 Imax:40 A(短时冲击电流承受能力)
  • 耐压 Vmax:24 V(最大工作电压限制)
  • 消耗功率 Pd:800 mW(器件在特定工作点下的最大可耗散功率)
  • 动作时间:150 ms(从过流到进入保护状态的典型时间)
  • 工作温度范围:-40 ℃ ~ +85 ℃

三、主要特性与优势

  • SMD小型1812封装,便于自动贴装与波峰/回流焊工艺集成(具体焊接条件请参照厂家推荐工艺)。
  • 低初始电阻(150 mΩ),正常工作下压降小,降低功耗与发热。
  • 跳闸后阻值显著上升(至1.4 Ω),有效限制故障电流并促使系统恢复。
  • 可重复自恢复,无需更换器件,适合周期性短路或过流场合。
  • 宽温度范围,适应工业级环境。

四、典型应用场景

  • 工业与商用24V电源分支保护
  • 车载外围低压电路(需注意车载瞬态与脉冲)
  • USB/外设端口、接口短路保护(满足电压与电流需求)
  • 电源模块、LED驱动、通讯设备、家电板载保护

五、使用建议与注意事项

  • 选型原则:保证正常运行电流小于 Ihold,且在可能出现的故障电流下能迅速达到 Itrip。常规建议将工作电流控制在 Ihold 的80%以下以提高可靠性。
  • 电压限制:Vmax=24V,不可用于高于此电压的电源轨。
  • 热管理:器件的 Pd=800mW 表征其在特定环境下的功耗承受能力。实际应用中请考虑PCB散热、周围器件的热耦合与环境温度,必要时预留热流散路径或采用散热措施。
  • 冲击与瞬态:器件可承受高达 Imax 的短时冲击,但频繁的大冲击会降低寿命;对于含高能脉冲源的系统(如汽车启动、逆变器)应做额外浪涌抑制。
  • 焊接与装配:在无厂方工艺时,应遵循常规SMD贴片器件的回流曲线与最大温度限制;避免超出推荐热循环导致器件性能漂移。
  • 测试验证:在最终产品中应进行过流、过温、反复跳闸与复位测试,验证在目标负载与环境下的动作时间与复位特性。

六、检索与替代

BSMD1812-050-24V 属于1812封装的低电阻、低保持电流自恢复保险丝类别。选择替代产品时,请重点对比 Ihold、Itrip、Rmin、R1max、Vmax 及热特性,确保在目标应用中能复现保护特性与可靠性。

如需进一步的PCB占位建议、回流曲线或器件典型曲线(I-t、R-T、I-V),可依据佰宏(BHFUSE)官方数据手册获取详细图表与工艺规范。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.