WMSIC Electronic Components

BHFUSE BSMD1812-260-16V BSMD1812

ModelBSMD1812-260-16V
Package1812
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1812-260-16V
Type
BHFUSE
Minimum package
1500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1812-260-16V
Electronic Component
1
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.128g
Electronic Component
1
Electronic Component
2.5s
Electronic Component
BM0228072392
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
16V
Power(Pd)
1.2W
Current(Imax)
40A
Electronic Component
Electronic Component
Electronic Component
1500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1812-260-16V产品概述

一、产品简介

BSMD1812-260-16V为BHFUSE(佰宏)出品的表面贴装自恢复保险器(PTC/聚合物自恢复保险)。器件封装为1812,适用于空间受限但需高可靠过流保护的电子设备。器件在正常工作时呈低阻态,过流时增阻限流,故障消除后可自动恢复,便于维护与长期使用。

二、主要技术参数

  • 额定耐压(Vmax):16V
  • 最大承受电流(Imax):40A(瞬时能力)
  • 保持电流(Ihold):2.6A(设备在不跳闸情况下长期允许的最大电流)
  • 跳闸电流(Itrip):5.2A(在规定时间内开始显著增阻的电流)
  • 跳闸时间:2.5s(在Itrip条件下的动作时间参考)
  • 功耗(Pd):1.2W(在特定条件下的功耗限定)
  • 初始态电阻(Rmin):10mΩ(冷态低阻)
  • 跳断后电阻(R1max):70mΩ(动作后限流电阻上限)
  • 工作温度范围:-40℃ ~ +85℃

三、核心优势

  • 快速响应:在过流条件下2.5秒内动作,有效保护下游电路。
  • 高承载能力:40A瞬时承载保障浪涌与短时过载情况下的可靠性。
  • 可恢复性:跳闸后自动恢复,减少更换与停机成本。
  • 低初始阻抗:10mΩ起始阻值,降低正常工作时的功率损耗与压降。
  • 宽温工作范围:-40℃至+85℃,适配常见工业与消费电子环境。

四、典型应用

  • 消费类电子:平板、机顶盒、路由器等5V/12V供电保护。
  • 通信与网络设备:交换机、基站电源保护模块。
  • 商用与工业电源:电源管理板、配电模块浪涌保护。
  • 汽车电子(非严苛汽车等级场景):车载娱乐、辅助设备的短路保护(须评估热与振动要求)。

五、选型与注意事项

  • 电压余量:16V耐压应大于系统最大工作电压,推荐在额定电压下留有安全裕度。
  • 电流匹配:长期工作电流应小于Ihold(2.6A),典型过流场景峰值应低于Imax(40A),并注意Itrip(5.2A)对应动作时间。
  • 功耗与散热:Pd 1.2W表示在特定温度下的最大耗散,PCB散热和环境温度会影响器件动作特性,应在设计时验证热耦合效应。
  • 电阻变化:动作后阻值可达70mΩ,需评估动作时电压降与下游负载影响。

六、安装与可靠性

  • 封装1812适配常见SMT工艺;焊盘布局参考厂商推荐的足迹以确保热与机械性能。
  • 避免贴片过程中高温或过度机械应力,焊接时遵循回流曲线。
  • 建议做ESD与浪涌试验验证,并在最终产品环境温度下进行过流/恢复循环测试以确认可靠性。

七、包装与订购建议

  • 由佰宏生产,常见为卷带包装(供贴片机使用);批量采购时建议与供应商确认最小起订量与交期。
  • 在样机阶段建议订购少量样品进行系统级验证,再做批量投产确认。

总结:BSMD1812-260-16V以其低阻、高承载与自动恢复特性,适合对尺寸和可靠性有要求的过流保护场景。选型时重点关注工作电流、系统电压裕度与热管理,以确保长期稳定运行。

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