WMSIC Electronic Components

BHFUSE BSMD1206-020-24V BSMD1206

ModelBSMD1206-020-24V
Package1206
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1206-020-24V
Type
BHFUSE
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1206-020-24V
Electronic Component
1
Electronic Component
1.9mm
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.037g
Electronic Component
3.6mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0229474028
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
24V
Power(Pd)
600mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1206-020-24V 自恢复保险丝(BHFUSE)

一、产品概述

BSMD1206-020-24V 是佰宏(BHFUSE)出品的一款 1206 封装自恢复热敏式保险丝(PTC resettable fuse)。器件在正常工作电流下阻值很低,在过流或短路时迅速增阻限制电流,故障消除并冷却后可自动恢复到低阻态,适用于 USB 外围、便携设备、充电器及各类低电压保护场合。

二、主要参数

  • 封装:1206(表面贴装)
  • 外形尺寸:长度 3.6 mm,宽度 1.9 mm,高度 1.0 mm
  • 额定耐压:24 V max
  • 初始态阻值(Rmin):0.35 Ω
  • 跳断后阻值(R1max):2.7 Ω
  • 保持电流(Ihold):200 mA
  • 跳闸电流(Itrip):460 mA(典型)
  • 最大承受短时电流(Imax):40 A(瞬态冲击能力,非持续)
  • 功率耗散(Pd):600 mW
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 动作时间:100 ms(在规定过流条件下)

三、工作特性简述

该自恢复保险丝在电流小于 Ihold 时保持低阻抗并允许正常工作;当电流达到或超过 Itrip 时内部材料升温导致阻值急剧增加,限制电流到安全水平,从而保护后端电路。跳闸后器件阻值上升到 R1max(典型 2.7 Ω),故障清除并冷却后阻值可恢复接近 Rmin。Imax 指的是能承受的瞬态冲击能力,不代表连续工作电流。

四、封装与焊接建议

  • 采用 1206 标准焊盘布局,保证良好焊点和热传导。
  • 推荐按器件制造商提供的回流焊工艺曲线进行焊接,避免超过峰值温度和超时加热以防性能劣化。
  • 安装时应避免靠近大功率器件或热源,以降低误动作几率。

五、典型应用

  • USB / 数据口过流保护
  • 电池管理与便携设备短路保护
  • 家用电子、机顶盒、路由器前端保护
  • 电源适配器与充电器初级保护(低压侧)

六、设计与使用注意事项

  • 选型时保证 Ihold 高于正常最大工作电流,并有足够裕量;Itrip 应低于待保护电路可承受损害阈值。
  • 工作环境温度对 Ihold 和 Itrip 有影响:高温下器件更易跳闸,应考虑热降额。
  • 若电路中存在频繁冲击电流或高能故障,需评估器件寿命及是否需并联其他保护元件。
  • 对于关键应用,建议做热成像与老化测试以验证长期稳定性。

七、可靠性与测试建议

  • 建议进行多次往返跳闸恢复测试,监测初始阻值变化以评估寿命衰减。
  • 在目标工作温度和实际 PCB 布局下进行实际电流-时间特性测试,验证动作时间与 R1max 等指标是否满足系统要求。

八、选型建议

在替换或选型时,优先匹配 Vmax、Ihold、Itrip 及封装体积。若电流波动或环境温度较高,应选用更高 Ihold 或采用并联/级联保护策略以提高可靠性。

如需获取详细回流曲线、热阻和完整电流-时间曲线,请联系 BHFUSE 或查看器件数据手册以得到制造商权威规格与推荐的 PCB 布局。

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