WMSIC Electronic Components

BHFUSE BSMD0805-035-16V BSMD0805

ModelBSMD0805-035-16V
Package0805
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0805-035-16V
Type
BHFUSE
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0805-035-16V
Electronic Component
1
Electronic Component
1.5mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.028g
Electronic Component
2.2mm
Electronic Component
1.1mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0265569424
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
16V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0805-035-16V 自恢复保险丝产品概述

一、产品核心定位与典型应用场景

BSMD0805-035-16V是佰宏(BHFUSE)推出的0805贴片封装自恢复保险丝,专为低压小电流场景的过流保护设计,核心解决传统一次性保险丝需频繁更换、维护成本高的痛点,无需人工干预即可重复使用。

其典型应用覆盖三大领域:

  1. 消费电子终端:智能手机/平板的充电接口、耳机接口过流保护,智能手环/手表的电池充放电回路保护;
  2. 小型IoT设备:智能门锁、温湿度传感器的电源端保护,避免短路或过流损坏;
  3. 微型家电/车载周边:车载USB充电器、小型加湿器的电路保护,适配宽温环境需求。

二、关键电气参数与实际意义详解

该产品的电气参数精准匹配低压小电流场景,核心参数的实际应用价值明确:

1. 电压与电流核心规格

  • 最大耐压(Vmax=16V):保证产品在≤16V直流/交流电压下稳定工作,过压时不会击穿损坏,适配多数低压设备(如5V/12V电源系统);
  • 最大耐受电流(Imax=40A):可承受瞬间浪涌电流(如静电放电、开机冲击),避免误触发;
  • 保持电流(Ihold=350mA):正常工作时电流≤350mA不会触发保护,是选型时的关键电流阈值(如设备正常工作电流300mA可直接选用);
  • 跳闸电流(Itrip=750mA):当电流≥750mA时,产品在100ms内跳断,切断过流回路,保护后端敏感元件(如MCU、传感器)。

2. 电阻与功率特性

  • 初始态最小阻值(Rmin=200mΩ):正常工作时功耗极低(P=I²R,350mA时仅约24.5mW),几乎不影响设备性能,也无额外发热;
  • 跳断后最大阻值(R1max=1.2Ω):跳断后等效为高阻态,有效隔离过流故障,故障排除后阻值自动恢复;
  • 最大消耗功率(Pd=500mW):限制产品正常工作时的最大发热,避免长期过热老化。

3. 动作响应时间

  • 动作时间=100ms:过流触发后100ms内完成跳断,响应速度快,可有效防止后端元件因过流损坏(如锂电池过流保护需快速响应)。

三、机械封装与环境适应性

1. 0805贴片封装规格

尺寸为2.2mm(长)×1.5mm(宽)×1.1mm(高),符合主流贴片生产工艺,适配高密度电路板设计,可直接通过SMT贴装,无需额外手工焊接,提升生产效率。

2. 宽温工作范围

工作温度覆盖**-40℃~+85℃**,可适应低温环境(如北方户外IoT设备)、高温环境(如车载充电器),满足不同场景的可靠性需求。

四、产品核心优势与价值

  1. 自恢复免维护:故障排除后自动恢复导通,无需更换保险丝,降低设备售后维护成本;
  2. 小体积大耐受:0805封装实现40A瞬间浪涌耐受,兼顾小型化与抗冲击能力;
  3. 低功耗低发热:初始200mΩ阻值使正常工作时几乎无额外发热,不影响设备散热设计;
  4. 快速响应保护:100ms动作时间精准切断过流,避免敏感元件不可逆损坏。

五、选型与应用注意事项

  1. 选型匹配原则:
    • 设备工作电压≤16V;
    • 正常工作电流≤350mA;
    • 过流跳闸需求≥750mA(需结合实际场景验证);
  2. 应用限制:
    不适用高压(>16V)、持续大电流(>350mA)场景(如大功率电源适配器);
  3. 焊接注意:
    SMT焊接温度需符合0805封装标准(一般≤260℃/10s),避免高温损伤产品内部结构。

该产品凭借紧凑封装、精准参数与自恢复特性,成为低压小电流设备过流保护的优选方案,可有效提升设备可靠性与用户体验。

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