WMSIC Electronic Components

BHFUSE BSMD1206C-1800T BSMD1206C

ModelBSMD1206C-1800T
Package1206
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1206C-1800T
Type
BHFUSE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1206C-1800T
Electronic Component
1
Electronic Component
1.6mm
Package
1206
Type
SMD Fuse
Electronic Component
Non-Resettable Fuse
Electronic Component
0.036g
Electronic Component
3.2mm
I2t
15.4
Electronic Component
1
Electronic Component
150A
Electronic Component
BM0231068011
Operating Temperature
55℃~+150℃
Voltage
32V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1206C-1800T 产品概述

一、产品简介

BSMD1206C-1800T 是佰宏(BHFUSE)推出的一款1206封装贴片式熔断保险丝,适用于对过流保护有严格要求的消费电子、通信、电源模块及工业控制类应用。器件尺寸为3.2mm × 1.6mm(1206),设计用于表面贴装工艺,工作温度范围宽(-55℃至+150℃),便于在恶劣环境下长期可靠工作。

二、主要技术参数

  • 品牌:BHFUSE(佰宏)
  • 型号:BSMD1206C-1800T
  • 封装:1206(SMD)
  • 尺寸:长度 3.2 mm,宽度 1.6 mm
  • 类型:贴片式一次性熔断保险丝(SMD)
  • 额定电流:8 A
  • 额定电压(DC/AC):32 V
  • 分断能力(破断电流):150 A
  • 熔断能量(I2t):15.4(单位通常为 A²s,请以厂方数据页为准)
  • 工作温度:-55 ℃ 至 +150 ℃

三、关键性能解读

  • 分断能力 150 A:表示在规定测试条件下,保险丝能够安全切断高至150 A的短路电流,适合多数中高电流回路的短路保护需求。
  • 熔断 I2t = 15.4:这是保险丝熔断过程释放的能量指标,越小表示对下游电路的能量透过越低,有助于保护敏感元件。具体单位和测试条件请参阅厂方曲线。
  • 额定电流 8 A:为器件在规定环境下的持续工作电流上限。设计时建议留有裕度,避免长期接近或超过额定值运行以延长寿命并避免误动作。
  • 宽温特性:-55℃至+150℃的工作温度范围使该器件适用于汽车等级、军工以及高温工业场合(具体合规性以供应商认证为准)。
  • 1206 封装:在体积、耐热和可装配性之间取得平衡,适合自动贴装和回流焊工艺。

四、典型应用场景

  • 电源输入/输出保护:开关电源、适配器、DC-DC 模块的过流短路防护。
  • 通信设备:基站模块、路由器等需稳健过流保护的子系统。
  • 汽车电子(视认证情况):车载 12V/24V 系统中的非关键电路保护。
  • 工业控制与仪器:驱动器、传感器供电线路的短路及过载保护。

五、封装与焊接注意事项

  • 推荐采用标准 SMT 回流焊工艺,遵循厂方提供的回流曲线。如无具体曲线,参考1206 SMD常用回流峰值温度并控制峰值时间以防器件过热。
  • 在贴片与回流过程中避免机械应力与过度弯曲,焊盘设计应符合 IPC 推荐的1206 芯片元件焊盘规范以保证焊接可靠性。
  • 建议在量产前进行实际 PCB 装配与功能验证,校准焊接参数和锡膏印刷量,防止焊接不良导致接触阻抗异常或热解变化。

六、存储与可靠性建议

  • 储存于干燥、阴凉环境,避免潮湿与强光直射。贴片元件通常按湿敏等级处理,若贴装时间超过建议曝光时间,应按回流前的烘烤规范处理。
  • 在高温或高湿环境应用时,建议进行加速老化与热循环测试以验证长期可靠性。

七、采购与识别提示

  • 选型时请与佰宏官方资料核对完整数据手册,确认熔断特性曲线(时间-电流曲线)、I2t 单位及测试条件。
  • 采购批次应关注生产批号和合格证明,必要时要求出具完整测试报告或来样验证,以确保在目标应用内满足性能与寿命要求。

如需更详尽的时间-电流特性曲线、典型熔断测试图或建议的 PCB 焊盘尺寸图,请提供联系信息或告知需要,我可协助整理并与厂方数据比对后提供。

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