WMSIC Electronic Components

BHFUSE BSMD0805L-260 BSMD0805L

ModelBSMD0805L-260
Package0805
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0805L-260
Type
BHFUSE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0805L-260
Electronic Component
1
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.032g
Electronic Component
1
Electronic Component
12s
Electronic Component
BM0231067999
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
1W
Current(Imax)
50A
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0805L-260 自恢复保险丝产品概述

一、产品简介

BSMD0805L-260 是 BHFUSE(佰宏)推出的一款0805封装自恢复聚合物保险丝(PTC resettable fuse),适用于低电压、高瞬态电流保护场合。其设计目标是在过流或短路发生时迅速限制电流并自动断开,故障消除后自动恢复导通,从而保护系统和负载,避免传统熔断器更换带来的维护成本与停机时间。

主要参数(典型/最大值)

  • 型号:BSMD0805L-260(0805 封装)
  • 初始态阻值 Rmin:3 mΩ
  • 跳断后阻值 R1max:35 mΩ
  • 保持电流 Ihold:2.6 A
  • 跳闸电流 Itrip:5.2 A
  • 最大额定电压 Vmax:6 V
  • 最大电流 Imax(冲击/短时):50 A
  • 动作时间(至跳闸):约 12 s(在 Itrip 条件下)
  • 允许消耗功率 Pd:1 W
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:0805

二、关键电气特性解读

  • 低初始阻值(3 mΩ)意味着在正常工作状态下压降和发热非常小,有利于效率要求高的电源线或总线应用。
  • 当电流超过 Itrip(5.2 A)时,器件在典型约 12 s 内升温并将电阻显著提高到约 35 mΩ,从而限制通过的电流并保护 downstream 电路。
  • Pd(1 W)与器件跳闸时的功耗相匹配:按 Itrip 与 R1max 计算,P ≈ I^2·R = 5.2^2 × 0.035 ≈ 0.95 W,说明参数设定与热机制一致。
  • Vmax = 6 V 要求本器件仅用于 6 V 以下的系统(如 USB、单节锂电池和其他低压总线),不可直接用于 12 V 汽车主电源线等高压环境。

三、应用场景

  • USB 端口、充电接口和外围设备的过流保护(5 V 系统)
  • 手持设备、可穿戴设备和便携式电源管理线路
  • 单节锂电池保护、电池组局部电路保护(注意总电压限制)
  • 模块化电源、板上局部高峰电流抑制
  • 工业与消费类电子的短路和过载保护(在工作温度与电压限制内)

四、选型与使用建议

  • 选择原则:Ihold 应高于系统正常最大工作电流以防止误触发;Itrip 应低于可能导致损害的故障电流。对于连续工作接近 2–2.5 A 的设计,BSMD0805L-260 可作为合适保护件;若正常工作电流接近或超过 2.6 A,应考虑更高 Ihold 的型号。
  • 注意 Vmax = 6 V,任何高于此电压的应用都必须更换为更高电压等级的器件。
  • 对冲击电流能力(Imax 50 A)理解为短时浪涌容量,具体脉冲宽度和次数请参考厂方详细脉冲特性曲线或询厂方确认。
  • 环境与散热:器件的动作与恢复受 PCB 铜皮面积、周边温度等影响。增加铜箔面积有助于散热,提升 Itrip;反之,减小热散面积可降低跳闸电流。根据需要调整 PCB 热设计以避免不必要的误动作或延迟恢复。

五、封装与焊接建议

  • 0805 尺寸适合高密度 PCB 布局,但因体积小,热传导受 PCB 影响显著。设计时要考虑与其他热源的间距,避免周边器件发热导致误触发。
  • 建议采用标准 SMT 回流焊工艺;遵循厂商或通用 SMT 回流曲线进行焊接,避免长时间暴露于高温。焊接后建议做外观与电气检测(阻值、开路检查)。
  • 对可清洗性、助焊剂残留敏感的应用,参照厂方清洗兼容性说明执行。

六、可靠性与测试建议

  • 在最终产品中进行温升测试、重复过流循环测试和环境应力测试(高低温、振动)以评估实际恢复时间与漂移行为。
  • 对关键应用建议做实际业务场景下的寿命预估和反复触发后特性稳定性验证(如 Ihold、Rmin、R1max 的长期漂移)。
  • 若对冲击电流或频繁跳闸有特殊要求,可与供应商沟通获取更详细的脉冲特性曲线和老化测试数据。

总结:BSMD0805L-260 以其低初始电阻、明确的保持/跳闸电流和小型 0805 封装,适合低压(≤6 V)、瞬态电流较大但常态电流在 2.6 A 以下的保护场合。正确的 PCB 热设计与恰当的选型判断是保证其可靠性与长期稳定性的关键。若设计接近参数上限或需在更严苛环境下工作,建议向供应商索取完整数据手册并进行实际工程验证。

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