WMSIC Electronic Components

BHFUSE BSMD1206-025-30V BSMD1206

ModelBSMD1206-025-30V
Package1206
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1206-025-30V
Type
BHFUSE
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1206-025-30V
Electronic Component
1
Electronic Component
1.9mm
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.037g
Electronic Component
3.6mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0231068000
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
30V
Power(Pd)
600mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1206-025-30V 自恢复保险丝产品概述

一、产品简介

BSMD1206-025-30V 为 BHFUSE(佰宏)推出的一款 1206 封装自恢复保险丝(PPTC),专为表面贴装电路保护设计。该器件在过载或短路条件下自动限流并跳闸,故障消除后可自动恢复导通,适用于便携设备、电源模块及数据接口等对重复过流保护有要求的场合。

二、主要电气参数

  • 额定耐压(Vmax):30 V(最大工作电压,长期不得超限)
  • 最大承受电流(Imax):40 A(短时浪涌能力,非连续长期通电值)
  • 保持电流(Ihold):250 mA(器件在规定环境温度下可长期通过而不跳闸的最大电流)
  • 跳闸电流(Itrip):500 mA(在规定条件下将触发热跳闸的典型电流)
  • 功率消耗(Pd):600 mW(在额定条件下的最大持续功耗)
  • 初始态电阻(Rmin):350 mΩ(冷态接触电阻,影响压降与发热)
  • 跳断后电阻(R1max):2.5 Ω(热跳闸状态下的高阻值,用以限流)
  • 动作时间:100 ms(从过流到跳闸的参考时间)
  • 工作温度范围:-40 ℃ 至 +85 ℃

三、封装与物理尺寸

  • 封装类型:1206 表面贴装(SMD)
  • 外形尺寸:长度 3.6 mm × 宽度 1.9 mm × 高度 1.0 mm
    体积小、易于自动贴装与回流焊接,适配常见 1206 炉温/工艺。

四、产品特点与优势

  • 自恢复设计:在瞬态或短时故障之后无需更换,降低维护成本。
  • 小型化封装:1206 尺寸兼容主流 SMT 工艺,利于高密度 PCB 布局。
  • 快速响应:约 100 ms 动作时间,能有效限制突发过流带来的损害。
  • 宽温工作:-40~+85 ℃ 支持工业级应用环境。
  • 较低初阻:350 mΩ 有利于降低静态压降与热量积累。

五、典型应用场景

  • 移动设备与充电电路(USB、Type-C 端口等)
  • 工业与通信设备的局部电源保护
  • 电池管理与便携电源防护
  • 信号线及小功率模块过流保护

六、设计与使用建议

  • 选型时将 Ihold 略高于电路正常工作电流,避免误触发;Itrip 应高于最大工作电流但低于可能损伤电路的电流。
  • 注意 Imax 为短时浪涌能力,不可作为连续工作电流参考。
  • 在高环境温度下器件热裕度下降,应进行热降额设计(derating),并留出散热空间。
  • PCB 布局建议靠近被保护端,减少导线电感与接触电阻,焊接时遵循厂家回流曲线以保障长期可靠性。
  • 对于关键安全应用,建议并联或串联其他保护措施(例如限流电阻、TVS 二极管)以实现多重保护。

七、包装与可靠性

该型号采用适合 SMT 贴装的卷带包装,支持自动化生产与回流焊流程。具有良好的循环自恢复能力,但长期在高温高电流条件下会影响寿命,建议在规格范围内使用并按厂家技术说明书进行存储与回流工艺控制。

如需更详细的电流-时间特性曲线、热性能曲线或封装 3D 图纸,可向供应商索取完整数据手册。

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