WMSIC Electronic Components

BHFUSE BSMD0805-050-30V BSMD0805

ModelBSMD0805-050-30V
Package0805
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0805-050-30V
Type
BHFUSE
Minimum package
4000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0805-050-30V
Electronic Component
1
Electronic Component
1.5mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.025g
Electronic Component
2.2mm
Electronic Component
1.1mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0227636687
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
30V
Power(Pd)
800mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0805-050-30V 产品概述

一、产品简介

BSMD0805-050-30V 为佰宏(BHFUSE)出品的表面贴装自恢复保险元件(SMD PTC/Polyfuse),采用0805封装,尺寸小、厚度低、响应速度快,适用于需在狭小空间内实现过流保护的消费类与工业电子产品。典型用于USB、移动电源、IoT模块、摄像头和小功率电源保护回路。

二、主要技术参数

  • 尺寸:0805(长度2.2mm × 宽度1.5mm × 高度1.1mm)
  • 额定最大耐压:30V
  • 保持电流(Ihold):500mA(器件在此电流下长期不跳闸)
  • 跳闸电流(Itrip):1A(超过此电流时器件在规定时间内动作)
  • 最大允许电流(Imax,冲击):40A
  • 初始态阻值(Rmin):100mΩ(典型未触发时串联电阻)
  • 跳断后阻值(R1max):850mΩ(触发后限制电流的阻值)
  • 功率损耗(Pd):800mW(器件在规定条件下的最大允许功耗)
  • 动作时间:100ms(典型响应时间,取决于过流幅值)
  • 工作温度:-40℃ ~ +85℃

三、关键特性与优势

  • 低初始阻值(约100mΩ),在工作电流下电压降小,适合低压、低损耗场景。
  • 快速动作(≈100ms),能有效抑制短时过流对下游电路的损害。
  • 高冲击承受能力(Imax=40A),可应对短时浪涌电流或浪涌事件。
  • 小巧0805封装,兼容自动贴装与回流焊工艺,便于集成于空间受限的PCB。
  • 宽温区运行(-40~85℃),适合多种环境应用。

四、应用建议与选型注意

  • 连续工作电流应低于Ihold;建议采用保守裕量(如≤80% Ihold,即≤400mA)以减少因环境温度上升或板上热密集导致的误触发。
  • 跳闸状态下的阻值与功耗:R1max=850mΩ 时,若维持在 Itrip(1A),器件功耗约0.85W,略高于Pd=0.8W。由此建议避免长时间让器件在接近跳闸电流的条件下持续工作,以免过热或降额。
  • 对存在较大浪涌或启动电流的应用(例如电机、背光等),需要评估浪涌幅值与持续时间,必要时配合限流电阻或NTC来避免误触发或对器件造成过度应力。
  • 布局与散热:0805封装受PCB铜箔面积影响明显。建议在器件两端增加铜箔面积或过孔以利热量分散,保证器件在高环境温度下仍能保持额定性能。
  • 焊接工艺:兼容常规回流焊,但应遵循厂商的回流温度曲线和焊接时长限制,避免过热造成器件性能退化。

五、总结

BSMD0805-050-30V 提供了低阻抗、快速保护与高冲击承受能力的组合,适合对体积和性能有双重要求的电路保护方案。选型时以Ihold为长期工作目标,注意环境温度与热设计,并对可能的浪涌情形做好配套措施,可获得稳定可靠的过流保护效果。若需更详细的电气特性曲线、回流工艺和可靠性数据,建议联系佰宏获取规格书与应用笔记。

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