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BHFUSE BSMD1812-150-24V BSMD1812
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BHFUSE BSMD1812-150-24V
- Type
- BHFUSE
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BHFUSE
- Electronic Component
- BSMD1812-150-24V
- Electronic Component
- 1
- Electronic Component
- 3.41mm
- Package
- 1812
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.119g
- Electronic Component
- 4.73mm
- Electronic Component
- 1.5mm
- Electronic Component
- 1
- Electronic Component
- 500ms
- Electronic Component
- BM0226603787
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 24V
- Power(Pd)
- 1W
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSMD1812-150-24V — 自恢复保险丝产品概述
一、产品简介
BSMD1812-150-24V 是佰宏（BHFUSE）推出的一款 1812 封装表面贴装自恢复保险丝（PTC）。该器件用于电路过流保护，能在过载或短路时迅速升温增阻而限制电流，故障消除后可自动恢复导通，适合重复保护需求的低压系统。
二、主要技术参数
- 封装：1812（尺寸：长度 4.73mm × 宽度 3.41mm × 高度 1.5mm）
- 额定耐压：Vmax = 24V
- 保持电流：Ihold = 1.5A（可长期通过而不动作）
- 跳闸电流：Itrip = 3A（在规定条件下开始进入高阻态）
- 最大可承受电流：Imax = 40A
- 初始态阻值：Rmin = 40 mΩ
- 跳断后阻值：R1max = 160 mΩ
- 动作时间：典型 500 ms（实际随过流倍率和环境温度变化）
- 功耗：Pd = 1W（额定功耗散）
- 工作温度：-40 ℃ ~ +85 ℃
三、产品特性与优势
- 低阻态下的初始电阻（约 40 mΩ）可减少正常工作时的功率损耗。
- 在过流时快速增阻（跳断后阻值 ≤ 160 mΩ），有效限制故障电流，保护下游器件。
- 自恢复特性避免了更换熔断丝的维护成本，适合频繁过载场合。
- 1812 SMD 封装兼容常见 SMT 工艺，便于自动贴装与回流焊接。
四、典型应用场景
- 24V 或以下的电源保护：通信设备、工业控制模块、车载电子（需评估环境与认证要求）。
- 电池保护与充电管理电路（作为过流限制与短路保护）。
- 电机驱动、继电器线圈及线路保护的局部防护。
五、选型与使用建议
- 常态工作电流应低于 Ihold，建议留有裕量（一般建议正常工作电流 ≤ 0.7~0.8 × Ihold），以避免环境温度或长期发热导致误动作。
- 若系统存在较大启动涌流，需确认涌流幅值和持续时间是否会触发器件（动作时间典型 500 ms，短时脉冲可能不会触发）。
- 布局时将器件靠近被保护电源入口放置，保证良好的散热条件；避免被其它发热元件包围导致温漂。
- 对于车规或高可靠性场合，建议结合实际环境试验验证性能。
六、注意事项与可靠性提示
- 器件额定工作温度范围为 -40 ℃ 至 +85 ℃，高温环境会降低动作阈值，应考虑温度系数并进行热仿真或实测。
- 虽具自恢复特性，但频繁大幅跳闸会缩短器件寿命或造成周边元件应力，设计时应优先分析故障原因并采取限流或熔断等配合保护。
- 在关键安全或需特殊认证的应用（如车辆动力系统）中，应确认满足相关认证与系统级安全要求。
如需规格书（Datasheet）、温度-电流曲线、封装图或定制参数对比，我可根据您具体的应用场景继续提供测试数据与选型建议。
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