WMSIC Electronic Components

BHFUSE BSMD0603-075-12V BSMD0603

ModelBSMD0603-075-12V
Package0603
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0603-075-12V
Type
BHFUSE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0603-075-12V
Electronic Component
1
Electronic Component
1.05mm
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.029g
Electronic Component
1.85mm
Electronic Component
1.15mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0264819714
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
12V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0603-075-12V 产品概述

一、产品概述

BSMD0603-075-12V 是佰宏(BHFUSE)出品的小型自恢复熔断保护器(PPTC/自恢复保险丝)封装为 0603,专为便携电子设备的过流保护而设计。器件外形接近标准 0603(0.06 × 0.03 英寸 / 1.5 × 0.8 mm),实际器件标称尺寸为 1.85 × 1.05 × 1.15 mm,低剖面、表面贴装,便于自动化贴装与回流焊工艺。

二、主要电气参数

  • 最大工作电压 (Vmax):12 V
  • 最大承受电流 (Imax):40 A(短时冲击)
  • 保持电流 (Ihold):0.75 A(750 mA)
  • 跳闸电流 (Itrip):1.5 A
  • 动作时间:典型 100 ms(达到跳闸条件时响应迅速)
  • 功耗 (Pd):0.5 W(500 mW)
  • 初始态电阻 (Rmin):60 mΩ(低电阻,有利于降低发热与压降)
  • 跳断后电阻 (R1max):450 mΩ(恢复态电阻上升,限制故障电流)
  • 工作温度范围:-40 ℃ 至 +85 ℃

三、产品特性

  • 快速响应对故障电流进行保护,能在短时间内限制过流损害。
  • 低初始电阻,降低工作时的功耗与压降,适合电源线与信号线保护。
  • 自恢复功能:故障消除后自动恢复导通,减少维护和更换成本。
  • 符合 RoHS 要求,无铅、无卤,符合现代环保工艺。
  • 兼容高温回流焊料,适配常见 SMT 组装流程。
  • 超小封装与低剖面设计,适合空间受限的移动设备与密集电路板布局。

四、典型应用

  • 笔记本、台式机与外设的电源与接口保护。
  • 手机、平板与可穿戴设备的电源与充电线路保护。
  • USB、PD、Type-C 接口过流防护。
  • 电池管理系统与便携式电源模块。
  • 其他需小型化过流保护的消费电子、通信与工业便携设备。

五、使用与选型建议

  • 当工作电压接近 12 V 或存在较大浪涌时,请核对器件的最大额定电压与实际工作环境。
  • 选型时以保持电流 Ihold 为常态工作电流参考,确保常态下不发生热触发;以跳闸电流 Itrip 判定器件在故障时的保护阈值。
  • PCB 布局应保证良好散热路径并遵循厂方推荐焊盘尺寸以获得最佳可靠性与焊接一致性。
  • 对需要严格热重复与寿命验证的设计,建议参考佰宏提供的详细数据手册与环境可靠性测试报告。

如需完整电气特性曲线、典型热阻、推荐焊盘尺寸与封装图纸,请联系供应商索取 BHFUSE 官方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.