WMSIC Electronic Components

BHFUSE BSMD0603C-0250T BSMD0603C

ModelBSMD0603C-0250T
Package0603
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0603C-0250T
Type
BHFUSE
Minimum package
5000 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0603C-0250T
Electronic Component
1
Electronic Component
0.8mm
Package
0603
Type
SMD Fuse
Electronic Component
Non-Resettable Fuse
Electronic Component
0.029g
Electronic Component
1.6mm
I2t
0.00046
Electronic Component
1
Electronic Component
50A
Electronic Component
BM0264819711
Operating Temperature
55℃~+150℃
Voltage
63V;32V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0603C-0250T 产品概述

一、主要参数

  • 类型:贴片式时间滞后保险丝(SMD,慢熔)
  • 型号:BSMD0603C-0250T
  • 额定电流:250 mA
  • 额定电压:63 V / 32 V(视具体子型号或应用需求)
  • 熔断能量(I2t):0.00046 A²s
  • 最大分断能力:50 A
  • 工作温度:-55 ℃ 至 +150 ℃
  • 外形尺寸:长 1.6 mm × 宽 0.8 mm(0603 封装)
  • 品牌:BHFUSE(佰宏)

二、产品特点

  • 时间滞后特性:对短时浪涌、电流尖峰有缓冲能力,适合含电容或瞬态启动电流的电路。
  • 无焊料终端设计:在使用过程中提供优异的开关与温度循环特性,增强耐热性与抗冲击能力。
  • 高分断能力:50 A 分断能力可在短路或严重故障时可靠切断,保护下游元件。
  • 微小封装:0603 超小尺寸,适合空间受限的现代便携与消费电子产品。

三、典型应用

  • 移动设备与便携式电子产品电源保护
  • USB、充电器与电源管理模块的输入/保护电路
  • 通信设备与网络终端的过流保护
  • LED 驱动器、电池管理与电源分配线路
  • 工业控制与测试设备(需根据环境和认证评估)

四、使用建议与注意事项

  • 贴片工艺:兼容常规 SMT 装配与回流工艺,但具体回流曲线与焊盘设计应参考厂方数据手册。
  • 选型提示:若电路中存在频繁的大幅浪涌或高温环境,请评估慢熔响应与额定电流裕量;对于不同系统电压请选择相应额定电压版本。
  • 环境与可靠性:长期在高温或振动环境下使用时,应进行可靠性验证,确认焊接可靠性与热循环性能。
  • 规格查询:在最终设计与采购前,请参阅佰宏官方数据手册以获取完整电气曲线、熔断时间-电流特性和封装推荐焊盘尺寸。

五、品牌与采购

  • 生产商:BHFUSE(佰宏),主打高可靠性的微型贴片保险丝系列。
  • 型号识别:BSMD0603C-0250T 为 0603 慢熔 250 mA 标准型号,适合对空间与可靠性有较高要求的设计。
    如需样品、完整规格书或兼容型号建议,建议联系佰宏或其授权经销商获取最新资料与支持。

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Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

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Mixed BOM triage Typical RFQ workflow

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Obsolete-part review Typical RFQ workflow

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Small-batch request Typical RFQ workflow

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Repair batch evidence Typical RFQ workflow

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Model suffix clarification Typical RFQ workflow

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Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

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