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BHFUSE BSMD0603-005-15V BSMD0603
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BHFUSE BSMD0603-005-15V
- Type
- BHFUSE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BHFUSE
- Electronic Component
- BSMD0603-005-15V
- Electronic Component
- 1
- Electronic Component
- 1.05mm
- Package
- 0603
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.027g
- Electronic Component
- 1.85mm
- Electronic Component
- 1mm
- Electronic Component
- 1
- Electronic Component
- 1s
- Electronic Component
- BM0231067995
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 15V
- Power(Pd)
- 500mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSMD0603-005-15V 产品概述
一、主要特点
BSMD0603-005-15V 是佰宏（BHFUSE）推出的微型自恢复保险（PTC resettable fuse），封装0603，体积小、响应快，适用于对体积和成本敏感的电子产品。主要参数如下：耐压 Vmax = 15V，最大可承受峰值电流 Imax = 40A（短时峰值能力），保持电流 Ihold = 50mA，跳闸电流 Itrip = 150mA，额定消耗功率 Pd = 500mW。初始态阻值 Rmin = 3.8Ω，跳断后阻值 R1max ≤ 30Ω。动作时间约 1s，工作温度范围 -40℃ ~ +85℃，外形尺寸 长 1.85mm × 宽 1.05mm × 高 1.0mm。
二、电气性能解读
- 保持电流 Ihold（50mA）：在此电流下器件应保持低阻态并长期通过电流不跳闸；适合小电流保护场景。
- 跳闸电流 Itrip（150mA）：超过此电流器件将在约 1s 内升温并进入高阻态以限制故障电流。
- 最大峰值 Imax（40A）：指短时瞬态或短路情况下器件可承受的最大电流能力，但非持续工作电流。应用时应保证外部故障被及时清除。
- Pd = 500mW：器件在额定条件下的功耗限值，温升与周围散热条件有关，PCB布局需考虑热阻和散热。
三、机械与环境
- 封装：标准0603（表贴），适配自动贴装与回流焊；尺寸 1.85×1.05×1.0 mm。
- 温度范围：-40℃ 至 +85℃，适用工业级温度环境。长时间处于高温或受热源影响会降低动作精度与寿命。
四、典型应用场景
- USB、串口、传感器及小功率接口的过流/短路保护；
- 电池充电管理的输入保护（配合限流电路）；
- 家用电器控制板、工业控制小信号回路等需自恢复保护的场合。
五、PCB布局与焊接建议
- 建议靠近被保护的电源入口或接口放置，减少导线或铜箔产生的额外热阻。
- 回流焊温度曲线应符合元件制造商建议，避免过高峰值温度和长时间加热。
- 焊盘设计参考0603标准，避免过大铜面积直接在元件下方，以减少不必要的热散失或应力。
六、选型与注意事项
- 根据实际工作电流选择 Ihold 和 Itrip 有足够裕量（通常 Iworking ≤ 0.75 × Ihold）。
- 若系统存在长时间短路或高能量瞬变，需评估 Imax 与系统断开时间，必要时并联或外置快速熔断器/热熔断器协同保护。
- 注意环境温度对 Itrip 的影响，高温会降低器件跳闸电流，应留出温度裕度。
七、包装与质量
BHFUSE 提供标准化生产与表面贴装包装，适配SMT生产线。出货前通过外观、阻值与动作测试，具体包装、出货数量和认证信息可向供应商索取完整数据表与可靠性试验报告。
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