WMSIC Electronic Components

BHFUSE BSMD1206C-2200T BSMD1206C

ModelBSMD1206C-2200T
Package1206
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1206C-2200T
Type
BHFUSE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1206C-2200T
Electronic Component
1
Electronic Component
1.6mm
Package
1206
Type
SMD Fuse
Electronic Component
Non-Resettable Fuse
Electronic Component
0.03g
Electronic Component
3.2mm
I2t
51.9
Electronic Component
1
Electronic Component
150A
Electronic Component
BM0231068012
Operating Temperature
55℃~+150℃
Voltage
32V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1206C-2200T 产品概述

一、产品简介

BSMD1206C-2200T 是佰宏(BHFUSE)推出的一款 1206 尺寸贴片式保险丝,专为表面贴装电路的过流与短路保护设计。器件尺寸为 3.2mm × 1.6mm(1206),体积小、适合自动贴片与回流焊装配,适配空间受限的各类电子设备保护需求。

二、主要性能参数

  • 类型:贴片式(SMD)保险丝
  • 封装:1206(3.2mm × 1.6mm)
  • 型号:BSMD1206C-2200T(品牌:BHFUSE / 佰宏)
  • 额定电流:20 A
  • 额定电压:32 V(AC) / 32 V(标称)
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 熔断能量(I2t):51.9 A²s
  • 分断能力:150 A

三、产品特点

  • 小型化封装,便于高密度 PCB 设计与自动化生产。
  • 明确的熔断能量指标(I2t = 51.9 A²s)和 150 A 的分断能力,能够在短路情况下迅速切断电路,降低故障扩展风险。
  • 宽温工作范围(-55℃ 至 +150℃),适应严苛环境下的稳定工作需求。
  • 适配 32V 额定电压,适合常见的低压直流与交流供电系统保护。

四、典型应用场景

  • 手机基站、光通信设备与宽带终端等通信类电源前端保护。
  • 电源模块、DC-DC 转换器与整机母线短路保护。
  • 消费电子、工业控制、测试设备中对 PCB 尺寸和自动化装配有要求的过流保护。
  • 在 12V/24V 车载电源系统中可作为分支保护元件(使用时应考虑瞬态及系统需求)。

五、选型与使用建议

  • 长期工作电流建议低于额定电流以延长寿命,常见工程实践为在额定值的 70%–80% 范围内使用;对于频繁过载或高温环境应进一步留裕。
  • 结合熔断 I2t 与系统短路电流评估是否满足保护时间与能量需求;若系统短路电流或能量远大于本品分断能力(150 A),需选用更高能量等级保险保护。
  • 在车载或有高能量瞬态的场合,建议与抑制器件(如 TVS)配合使用,防止误断或器件本体受损。
  • 贴装时遵循 1206 的推荐焊盘与回流工艺规范,避免过度热应力集中。

六、包装、焊接与储存

  • 本产品为 SMD 封装,适合自动贴装机贴装与回流焊接;请按制造商推荐的回流温度曲线执行焊接。
  • 存放时避免潮湿与强酸强碱环境,长期储存建议密封包装并保持室内常温干燥。
  • 操作与测试过程中注意防止机械冲击与弯折,避免在未断电情况下对保险丝进行过流测试以免损坏设备。

总结:BSMD1206C-2200T 以其 1206 小型封装、20A 额定电流与 32V 额定电压,配合明确的 I2t 与分断能力,适用于中高电流密度且空间受限的 PCB 过流保护场合。选型时请结合系统短路电流、工作温度与长期负载条件进行合理余量设计。若需完整电气特性曲线与焊接资料,建议向 BHFUSE 获取详细数据表与应用说明。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.