WMSIC Electronic Components

BHFUSE BSMD1812-200-24V BSMD1812

ModelBSMD1812-200-24V
Package1812
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1812-200-24V
Type
BHFUSE
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1812-200-24V
Electronic Component
1
Electronic Component
3.41mm
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.129g
Electronic Component
4.73mm
Electronic Component
1.5mm
Electronic Component
1
Electronic Component
2s
Electronic Component
BM0226534892
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
24V
Power(Pd)
1W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1812-200-24V 产品概述

一、产品简介

BSMD1812-200-24V 为佰宏(BHFUSE)出品的自恢复式贴片过流保护元件(PPTC),采用标准1812 SMD封装,专为24V工作环境下的线路保护设计。典型标称应用为24V系统中 2A 等级的过流保护,能在短路或异常电流出现时迅速限制电流并在故障清除后自动恢复。

二、主要参数

  • 品牌:BHFUSE(佰宏)
  • 封装:1812(尺寸:长 4.73mm × 宽 3.41mm × 高 1.5mm)
  • 额定电压:Vmax = 24V
  • 保持电流:Ihold = 2A(在规定环境温度下不动作)
  • 跳闸电流:Itrip = 4A(在规定条件下约 2s 动作)
  • 最大承受瞬时电流:Imax = 40A(短时冲击,不可长期承载)
  • 初始电阻:Rmin = 20mΩ
  • 跳闸后最大残余电阻:R1max = 100mΩ
  • 功耗(Pd):1W
  • 工作温度:-40℃ ~ +85℃
  • 动作时间:约 2s(在接近 Itrip 条件下)

三、关键特性与工作原理

该器件为聚合物正温度系数(PTC)自恢复保险:正常工作时呈低阻抗(初始态 Rmin≈20mΩ),当电流超过 Itrip(或因持续过流)导致发热时,材料阻值快速上升至高阻态(跳闸态 R≤R1max),从而限制电流。故障解除并冷却后阻值恢复,器件可重复使用。Imax 表示短时耐受的大电流冲击能力,但不可作为长期工作电流。

四、典型应用场景

  • 24V 工业控制电源保护(电机驱动前端、PLC I/O)
  • 通信设备、交换机及24V外围模块的输入保护
  • 嵌入式系统、网关和控制器的接口及电源滤波前置保护
  • 电源总线与外设之间的过流、短路保护

五、封装与布局建议

  • 建议将元件靠近电源输入或保护对象放置,减少保护回路电感和热耦合误差。
  • 使用与1812 封装相匹配的焊盘尺寸,遵循厂家推荐的回流焊工艺;常见 SMT 回流(需参见佰宏具体资料以确认温度曲线)。
  • 考虑散热与环境温度影响,若工作环境偏高,应对 Ihold 进行适当降额设计。

六、使用与可靠性注意事项

  • 正常设计中应使工作电流小于或等于 Ihold(推荐留裕量,如 ≤ 80% Ihold),以避免误动作。
  • 避免长时间超过 Itrip 工作,短时冲击可由 Imax 承受但应限制持续时间。
  • 环境温度、PCB 设计及相邻元件散热都会影响动作电流和时间,设计时务必参考实际温升曲线与样品测试。
  • 不建议在超过 24V 的系统中使用,避免过压导致损坏或失效。

七、采购与技术支持

如需样品、批量采购、完整电气特性曲线与回流焊工艺参数,请联系佰宏(BHFUSE)或其授权分销商获取最新版数据手册与可靠性测试报告。产品适用于需要重复自恢复保护且占板面积受限的24V贴片应用。

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