Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BHFUSE BSMD1206-035-30V BSMD1206
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BHFUSE BSMD1206-035-30V
- Type
- BHFUSE
- Minimum package
- 3500 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BHFUSE
- Electronic Component
- BSMD1206-035-30V
- Electronic Component
- 1
- Electronic Component
- 1.9mm
- Package
- 1206
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.039g
- Electronic Component
- 3.6mm
- Electronic Component
- 1mm
- Electronic Component
- 1
- Electronic Component
- 100ms
- Electronic Component
- BM0227637265
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 30V
- Power(Pd)
- 600mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSMD1206-035-30V 产品概述
一、产品简介
BSMD1206-035-30V（佰宏 BHFUSE）为1206封装表贴自恢复保险元件（PPTC/自恢复保险丝），用于电路过流保护。器件外形尺寸符合1206规格，长度3.6mm、宽度1.9mm、高度1.0mm，适配常见SMT工艺与高密度PCB布局。典型用于USB、便携终端、通信设备及车载电子等需要快速、可重复保护的场合。
二、主要电气参数
- 额定耐压：最大允许电压 30VDC
- 初始阻值（Rmin）：250 mΩ，保证正常工作时低压降
- 跳闸后阻值（R1max）：1.5 Ω，提供有效限流保护
- 保持电流（Ihold）：350 mA（器件在该电流下长期不动作）
- 跳闸电流（Itrip）：750 mA（在指定温升条件下发生动作）
- 最大通过瞬态电流（Imax）：40 A（短时脉冲可承受，非连续工作电流）
- 功耗 Pd：600 mW（器件的功耗参数，用于热设计）
- 动作时间：典型 100 ms（在过流事件下达到跳闸）
- 工作温度范围：-40℃ ~ +85℃
三、功能特点
- 自恢复：过流后进入高阻限流状态，故障消除后自动恢复到低阻态，便于重复使用并降低维护成本。
- 低压降：初始阻值仅250 mΩ，适合对供电电压敏感的应用。
- 快速动作：约100 ms动作时间能够有效保护短路或突发过流。
- 高浪涌承受：最大40 A短时承受能力，能应对开机浪涌和电感性负载的短时冲击。
四、典型应用
- USB/USB OTG/Type-C 接口过流保护
- 移动电源与充电器防护
- 通信设备、路由器、电源模块输入保护
- 工业与车载电子的电源前端保护（需按工作温度与认证评估）
五、选型与使用建议
- 保持电流(Ihold)应不小于电路正常最大持续电流，留有20~30%裕量以避免误动作；跳闸电流(Itrip)应低于电路容许的危险电流水平以实现保护。
- 注意器件功耗与PCB散热：Pd为600 mW，长期高电流下需保证周围铜箔与散热路径，避免靠近热源。
- 环境温度影响：高温会降低Itrip/增加动作可能性，实际使用中建议参照厂商温度特性曲线进行降额设计。
- 对于要求严格的安全/认证场合，需与供应商确认曲线和老化测试数据。
六、安装与注意事项
- 推荐标准SMT回流工艺，避免重复焊接造成性能变化；焊接温度和时间应遵循供应商回流曲线。
- 摆放时保证焊盘尺寸与铜厚符合1206工艺规范，必要时增加热沉铜箔以改善散热。
- 避免长时间在超过额定工作温度的环境中工作，以免提前触发或降额。
七、可靠性与维护
BSMD1206-035-30V经过常规老化与温度循环测试，适用于大多数民用与工业环境。对于关键系统建议进行样机验证，包括短路恢复、电热循环与浪涌试验，确保在目标应用中满足可靠性与安全要求。
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