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BHFUSE BSMD1206C-0500T BSMD1206C
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BHFUSE BSMD1206C-0500T
- Type
- BHFUSE
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BHFUSE
- Electronic Component
- BSMD1206C-0500T
- Electronic Component
- 1
- Electronic Component
- 1.6mm
- Package
- 1206
- Type
- SMD Fuse
- Electronic Component
- Non-Resettable Fuse
- Electronic Component
- 0.036g
- Electronic Component
- 3.2mm
- I2t
- 0.0025
- Electronic Component
- 1
- Electronic Component
- 50A
- Electronic Component
- BM0231068013
- Operating Temperature
- 55℃~+150℃
- Voltage
- 72V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSMD1206C-0500T 产品概述
一、产品简介
BSMD1206C-0500T 为佰宏（BHFUSE）出品的贴片式熔断器，采用1206（3.2mm × 1.6mm）封装，额定电流 500 mA，额定电压 AC/DC 72 V，工作温度范围 -55 ℃ 到 +150 ℃。该型号熔断 I2t 为 0.0025（A²s），分断能力高达 50 A，适用于需要快速保护与高分断能力的电子电路。
二、主要特性
- 小型贴片封装（1206），便于高密度 PCB 设计与自动化贴装；
- 额定 500 mA，72 V 工作电压，适配中低压保护需求；
- 低 I2t 值，响应迅速，能在短路发生时快速切断电流，减小对后端电路的冲击；
- 50 A 分断能力，可承受较大短路电流，提升系统安全性；
- 宽工作温度范围，可靠性强，适应工业级环境。
三、典型应用
适用于通信设备、电源模块、LED 驱动、电池管理与便携消费类电子等领域的过流与短路保护；在需要尺寸受限且要求快速断开与高分断能力的场景中表现优良。
四、封装与机械特性
1206 标准 SMD 尺寸（长 3.2 mm、宽 1.6 mm），兼容常见贴装与回流焊工艺。器件体积小、质量轻，适合自动化 SMT 流程，但在设计焊盘与回流曲线时应参照厂商推荐的封装图与工艺参数以保证焊接质量与可靠性。
五、使用注意事项
- 选型时应考虑到实际工作电流、启动冲击电流与 I2t，必要时留有裕量以避免误熔断；
- 虽然工作温度上限为 +150 ℃，但回流焊峰值温度与时间需遵循厂家工艺指南，避免因过热导致性能退化；
- 在高频繁动作或受机械振动环境中，应注意电气与机械应力对寿命的影响；
- 如需用于汽车或特殊环境，请核对是否满足相关认证和额外可靠性要求。
六、选型建议与资料获取
在最终选型前，应参考佰宏提供的完整数据手册，查看时间-电流特性曲线、耐久性测试与焊接工艺说明。对短路能量较高的系统，优先选择分断能力合适且具有足够 I2t 余量的型号。如需定制或批量采购，可联系佰宏授权代理获取样品与技术支持。
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