WMSIC Electronic Components

BHFUSE BSMD1206C-2150T BSMD1206C

ModelBSMD1206C-2150T
Package1206
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1206C-2150T
Type
BHFUSE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1206C-2150T
Electronic Component
1
Electronic Component
1.6mm
Package
1206
Type
SMD Fuse
Electronic Component
Non-Resettable Fuse
Electronic Component
0.036g
Electronic Component
3.2mm
Electronic Component
0.6mm
I2t
18.2
Electronic Component
1
Electronic Component
150A
Electronic Component
BM0231068010
Operating Temperature
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1206C-2150T 产品概述

一、产品简介

BSMD1206C-2150T 为 BHFUSE(佰宏)出品的 1206 贴片式保险丝,额定电流 15A,额定电压 32V,专为对体积、可靠性与可焊性有较高要求的表贴电路保护设计。器件适用于直流或低频电源侧的过流保护,可集成于各种工业与汽车电子系统中,提供快速、可靠的短路/过载断开能力。

二、主要参数

  • 品牌:BHFUSE(佰宏)
  • 型号:BSMD1206C-2150T
  • 尺寸(典型):3.2 mm × 1.6 mm(1206 封装)
  • 额定电流:15 A
  • 额定电压:32 V
  • 分断能力(Irm):150 A(最大断开能力)
  • 熔断能量(I2t):18.2 A²s
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 类型:贴片式(SMD)保险丝

三、特点与优势

  • 高分断能力:150A 分断能力可应对瞬时短路及高电流冲击,适合高能量场合保护。
  • 宽工作温度:-55℃ 至 +150℃,适用于工业级和部分汽车级严苛温度环境。
  • 小型化封装:1206 SMD 尺寸便于高密度 PCB 布局,适配自动贴装与回流焊工艺。
  • 可控熔断特性:I2t 值 18.2 A²s 提供明确的熔断能量参考,便于与负载特性匹配。

四、典型应用

  • 汽车电子(车载电源保护、控制模块)
  • 通讯设备与基站电源保护
  • 工业控制与驱动系统(逆变器、伺服驱动)
  • 电池保护、电源管理模块与 LED 驱动电路
  • 测试与测量仪器的输入保护

五、封装与安装建议

  • 器件为 1206 SMD,建议使用自动贴装与标准回流焊流程。
  • 焊接时遵循焊膏量与焊盘尺寸的良好实践,避免过多焊膏导致机械应力或焊瘤。
  • 建议按照电路板设计预留适当的热扩散与散热路径,避免长期高温退化。
  • 避免在器件未冷却时施加机械压力,运输和插装过程中使用防静电和防振措施。

六、可靠性与检验

  • 出厂前应进行电气测试确认额定电流与熔断特性;对关键应用建议做样件高低温循环、振动与冲击测试。
  • 在设计阶段建议结合实际负载做熔断曲线与时间-电流曲线验证,确保动作时间与保护要求一致。
  • 如用于安全相关系统,请参照系统级标准与认证要求,进行相应的加速寿命与可靠性验证。

七、选型与注意事项

  • 选型时不仅考虑额定电流,还需留有合适的余量并参考熔断 I2t 与负载的短路能量。
  • 对于交流或高压场合应确认器件的额定电压与分断能力是否满足要求。
  • 若需要更详细的封装图、回流曲线或认证资料,请参考 BHFUSE 官方规格书或联系供应商获取样品与数据支持。

如需我帮您出具熔断曲线、建议 PCB 焊盘尺寸或对比同类规格器件,我可继续提供详细支持。

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