WMSIC Electronic Components

BHFUSE BSMD1812-010-60V BSMD1812

ModelBSMD1812-010-60V
Package1812
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1812-010-60V
Type
BHFUSE
Minimum package
1500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1812-010-60V
Electronic Component
1
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.093g
Electronic Component
1
Electronic Component
BM0228072376
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
60V
Power(Pd)
800mW
Current(Imax)
40A
Electronic Component
Electronic Component
Electronic Component
1500
Latching Current(Ihold)
100mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1812-010-60V 产品概述

一、产品简介

BSMD1812-010-60V 是 BHFUSE(佰宏)出品的一款表面贴装可复位保险元件(PTC复位保险丝),封装尺寸为 1812。该器件在正常工作时呈低阻抗状态,当电路出现过流或短路情况导致器件自加热到一定温度后,其阻值迅速上升,从而限制流经电路的电流以保护下游器件。故障消除后,器件会随温度下降恢复到初始低阻状态,可以多次使用,适合需要反复保护的电子系统。

二、主要性能参数

  • 品牌:BHFUSE(佰宏)
  • 封装:1812(SMD)
  • 初始态阻值(Rmin):0.75 Ω(750 mΩ)
  • 跳断后阻值(R1max):15 Ω
  • 最大耐压(Vmax):60 V
  • 跳闸电流(Itrip):300 mA(典型触发电流)
  • 保持电流(Ihold):100 mA(持续不触发的最大电流)
  • 最大瞬时电流(Imax):40 A(短时冲击承受能力)
  • 最大功耗(Pd):800 mW
  • 工作温度范围:-40 ℃ ~ +85 ℃

三、产品特性与优势

  • 可复位保护:在过流事件处理后可自动恢复,省去更换一次性保险丝的麻烦,降低维护成本。
  • 低初始电阻:0.75 Ω 初始阻值在正常工作状态下对电路影响较小,适用于对压降敏感的小电流回路。
  • 明确的触发与保持区分:100 mA 的保持电流和 300 mA 的跳闸电流为电路设计提供了清晰的安全裕量。
  • 高耐压与抗冲击能力:60 V 的耐压等级适配多数低压系统,同时 40 A 的短时承受能力能够应对瞬时浪涌。
  • 可靠的温度性能:-40℃ 至 +85℃的工作温区覆盖工业级应用环境。

四、典型应用场景

  • 电源输入和分支保护:如USB、适配器、充电器等输入侧过流保护。
  • 电池保护模块:电池组及便携设备的短路和过流防护。
  • 通信和安防设备:保护小功率模块与接口电路免受异常电流冲击。
  • 家电与照明驱动:LED驱动、小型电机及控制电路的过流保护。
  • 工业控制与测控设备:对精密传感器和控制单元提供稳固保护。

五、选型与使用建议

  • 连续工作电流设计:建议连续工作电流保留裕量,通常将实际工作电流控制在 Ihold 的 70%~80% 以内(即建议≤80 mA)以避免环境温度或长期漂移引起误触发。
  • 耐压与系统匹配:在选型时确保系统工作电压低于 60 V,并考虑到瞬态尖峰需配合抑制元件(TVS、RC 等)使用。
  • 考虑冲击电流:Imax 为短时峰值能力,非长期工作电流;若系统存在频繁大电流脉冲,需评估器件寿命或选用更高规格型号。
  • 布局建议:尽量将器件放置在热量易散的区域,避免靠近高热源器件;焊盘与走线设计应满足良好散热与机械强度。

六、焊接与储存注意事项

  • 贴片封装适用于常规回流焊工艺,但建议遵循厂方的回流曲线以减少热应力(具体温度曲线以厂家资料为准)。
  • 储存与贴装过程中避免受潮与机械挤压,若为吸湿敏感器件,按规定进行回流前干燥处理。
  • 焊接后避免过度弯曲基板对器件产生机械应力。

七、测试与验证建议

  • 在实际电路中进行稳态和短路触发测试,验证 Ihold 与 Itrip 在目标环境温度下的实际表现。
  • 做寿命与循环测试以评估在预期过流事件频次下的可靠性。
  • 与系统级保护策略(限流电路、熔断器、过压抑制等)配合验证,确保在极端工况下的整体安全性。

总结:BSMD1812-010-60V 凭借其明确的保持/触发电流、可复位特性及 1812 封装的通用尺寸,是对低功耗、小电流电路进行可靠过流保护的优选方案。选型时应注重工作电流裕量、环境温度影响及系统瞬态特征,以获得最佳的保护效果与长期稳定性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.