WMSIC Electronic Components

BHFUSE BSMD1206-150-16V BSMD1206

ModelBSMD1206-150-16V
Package1206
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1206-150-16V
Type
BHFUSE
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1206-150-16V
Electronic Component
1
Electronic Component
1.9mm
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.042g
Electronic Component
3.6mm
Electronic Component
1.6mm
Electronic Component
1
Electronic Component
300ms
Electronic Component
BM0226534891
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
16V
Power(Pd)
1W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1206-150-16V 自恢复保险丝 产品概述

一、产品简介

BSMD1206-150-16V 是佰宏(BHFUSE)推出的一款1206封装表面贴装自恢复保险丝(PTC resettable fuse)。器件体积小(1206 尺寸,长3.6mm、宽1.9mm、高1.6mm),专为低压电源保护和短路/过流保护设计,适合空间受限的消费电子、通信和工业控制设备。

二、主要性能参数

  • 封装:1206(SMD)
  • 初始态阻值 Rmin:25 mΩ
  • 跳断后阻值 R1max:130 mΩ
  • 额定耐压 Vmax:16 V
  • 触发电流 Itrip:3 A
  • 保持电流 Ihold:1.5 A
  • 最大允许持续电流 Imax:40 A(短时或脉冲能力)
  • 最大功耗 Pd:1 W
  • 动作时间:约 300 ms(在规定过流条件下测得)
  • 工作温度范围:-40 ℃ ~ +85 ℃

三、关键特性与优势

  • 小型 SMD 封装,便于自动贴装与高密度 PCB 设计。
  • 低初始电阻(25 mΩ),对正常供电压降影响小,适合对压降敏感的电路。
  • 快速过流响应(动作时间≈300 ms),能在短时间内限制冲击电流与保护下游器件。
  • 自恢复特性,故障排除后可自动恢复导通,降低了维护成本。
  • 宽工作温度范围适用于多数民用与轻工业环境。

四、典型应用场景

  • USB、HDMI、Type-C 等接口的过流/短路保护。
  • 电源输入与分配线路的过流保护(低压直流系统,≤16 V)。
  • 可充电设备、移动电源及便携设备的线路保护。
  • IoT 设备、路由器、机顶盒等民用电子设备的板级保护。
    (注:不建议用作一次性延时熔断或高压主电路的主要保护)

五、设计与选型建议

  • 选型时以工作电流小于 Ihold 为目标,常规建议留 20%~50% 的裕度;若存在冲击电流,应参照器件的动作曲线选型。
  • 将保险丝放在电源入口或靠近保护对象处,最小化被保护线的长度以降低额外阻抗与热累积。
  • 结合 PCB 铜厚与过孔散热设计,Pd=1 W 为热极限参考,长时间高功耗会导致器件温升并改变动作特性。
  • 对于频繁高温或高湿环境,应评估器件长期漂移与重复动作后的阻值变化(R1max 指标)。

六、可靠性与封装信息

  • 1206 SMD 兼容常规回流焊工艺,建议遵循厂方回流温度曲线以避免热损伤。
  • 建议在物料购买时确认批次与完整技术资料(尺寸图、动作/保持电流曲线、耐久性测试)。
  • 对于关键应用,建议进行样机测试(实际电流、环境温度、脉冲条件)以验证系统级保护效果。

本器件以体积小、响应快、初始阻抗低为特点,适合多数低压电子产品的板级过流保护。选型与布局时请结合实际工作电流、脉冲特性与散热条件进行综合评估。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.